Power supply unit for aerosol generation device and aerosol generation device

ABSTRACT

A power supply unit for an aerosol generation device includes: a connector to which a heater configured to heat an aerosol source is connected; a power supply; a boost converter connected between the power supply and the connector; and a switch connected between the boost converter and the connector.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromprior Japanese patent application No. 2020-118741, filed on Jul. 9,2020, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a power supply unit for an aerosolgeneration device and the aerosol generation device.

BACKGROUND ART

Patent Literature 1 discloses a technology in which a boost converter isprovided between a power supply and a heater in a control main body ofan aerosol delivery device so that a voltage boosted by the boostconverter is applied to the heater. Patent Literatures 2 and 3 alsodisclose a technology in which a voltage converted by a converter thatconverts a voltage is applied to a heater.

-   [Patent Literature 1] JP-T-2019-527558-   [Patent Literature 2] JP-T-2017-538410-   [Patent Literature 3] US 2014/0299137 A1

From a viewpoint of improving a flavor during aerosol suction, it isdesired to increase a generation amount of an aerosol of an aerosolgeneration device. As a method of increasing the generation amount ofthe aerosol, it is conceivable to increase power supplied to a heaterthat heats an aerosol source. However, if excessive power is supplied tothe heater, a flavor may be reduced or user convenience may be reduced.In the related art, there is room for improvement from a viewpoint ofsupplying appropriate electric energy to the heater that heats theaerosol source.

SUMMARY OF INVENTION

The present invention provides a power supply unit for an aerosolgeneration device and the aerosol generation device that can supplyappropriate electric energy to a heater that heats an aerosol source.

According to an aspect of the invention, there is provided a powersupply unit for an aerosol generation device including: a connector towhich a heater configured to heat an aerosol source is connected; apower supply; a boost converter connected between the power supply andthe connector; and a switch connected between the boost converter andthe connector.

According to another aspect of the invention, there is provided anaerosol generation device including the power supply unit for theaerosol generation device according to the above, the aerosol generationdevice including: the power supply unit; the heater; a storage portionconfigured to store the liquid aerosol source; and a transport portionconfigured to transport the aerosol source from the storage portion to aposition where the aerosol source can be heated by the heater.

According to the present invention, it is possible to provide a powersupply unit for an aerosol generation device and the aerosol generationdevice that can supply appropriate electric energy to a heater thatheats an aerosol source.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of an aerosol inhaler according to anembodiment of the present invention.

FIG. 2 is an exploded perspective view of the aerosol inhaler of FIG. 1.

FIG. 3 is a cross-sectional view of the aerosol inhaler of FIG. 1.

FIG. 4 is a diagram showing a circuit configuration of a power supplyunit of the aerosol inhaler of FIG. 1.

FIG. 5 is a block diagram showing a configuration of an MCU of the powersupply unit in the aerosol inhaler of FIG. 1.

FIG. 6 is an enlarged view of main parts of the circuit configuration ofthe power supply unit in the aerosol inhaler of FIG. 1.

FIG. 7 is a schematic view showing main parts of the circuitconfiguration when a first surface of a circuit board of the aerosolinhaler of FIG. 1 is viewed from a right side.

FIG. 8 is a schematic view showing main parts of the circuitconfiguration when a ground layer of the circuit board of the aerosolinhaler of FIG. 1 is viewed from the right side.

FIG. 9 is a schematic view showing main parts of the circuitconfiguration when a power supply layer of the circuit board of theaerosol inhaler of FIG. 1 is viewed from the right side.

FIG. 10 is a schematic view showing main parts of the circuitconfiguration when a second surface of the circuit board of the aerosolinhaler of FIG. 1 is viewed from the right side.

DESCRIPTION OF EMBODIMENTS

Hereinafter, a power supply unit for an aerosol generation deviceaccording to an embodiment of the present invention will be described.First, an aerosol inhaler, which is an example of the aerosol generationdevice including the power supply unit of the present embodiment, willbe described with reference to FIGS. 1 to 3.

(Aerosol Inhaler)

An aerosol inhaler 1 is an instrument for generating an aerosol to whicha flavor is added without burning and sucking the generated aerosol,preferably has a size that fits in a hand, and has a substantiallyrectangular parallelepiped shape. The aerosol inhaler 1 may have anovoid shape, an elliptical shape, or the like. In the followingdescription, regarding the aerosol inhaler having the substantiallyrectangular parallelepiped shape, three orthogonal directions will bereferred to as an upper-lower direction, a front-rear direction, and aleft-right direction in descending order of length. Further, in thefollowing description, for convenience, as shown in FIGS. 1 to 3, afront side, a rear side, a left side, a right side, an upper side, and alower side are defined, and the front side is shown as Fr, the rear sideis shown as Rr, the left side is shown as L, the right side is shown asR, the upper side is shown as U, and the lower side is shown as D.

As shown in FIGS. 1 to 3, the aerosol inhaler 1 includes a power supplyunit 10, a first cartridge 20, and a second cartridge 30. The firstcartridge 20 and the second cartridge 30 are attachable to anddetachable from the power supply unit 10. In other words, the firstcartridge 20 and the second cartridge 30 are replaceable.

(Power Supply Unit) As shown in FIGS. 1 and 2, the power supply unit 10houses various sensors and the like such as a power supply 12, aninternal holder 13, a circuit board 60, and an intake sensor 15 inside apower supply unit case 11 having a substantially rectangularparallelepiped shape (hereinafter, also referred to as an inside of thecase). The power supply 12, the circuit board 60 (including an MCU 50, adischarging terminal 41, a charging terminal 43, and the like, whichwill be described later), and the like are collectively housed in thepower supply unit case 11, so that carrying by a user can be facilitatedand user convenience can be improved.

The power supply unit case 11 is configured with a first case 11A and asecond case 11B that are attachable and detachable in the left-rightdirection (thickness direction), and the first case 11A and the secondcase 11B are assembled in the left-right direction (thicknessdirection), so that a front surface, a rear surface, a left surface, aright surface, and a lower surface of the power supply unit 10 areformed. An upper surface of the power supply unit 10 is formed by adisplay 16.

A mouthpiece 17 is provided in the upper surface of the power supplyunit 10 in front of the display 16. In the mouthpiece 17, a suction port17 a protrudes further upward than the display 16.

An inclined surface inclined downward toward the rear side is providedbetween the upper surface and the rear surface of the power supply unit10. An operation unit 18 that can be operated by the user is provided onthe inclined surface. The operation unit 18 is configured with abutton-type switch, a touch panel, and the like, and is used whenactivating or interrupting the MCU 50 and various sensors by reflectinga use intention of the user, or the like.

The charging terminal 43, which can be electrically connected to anexternal power supply (not shown) that can supply power for charging thepower supply 12 to the power supply unit 10, is provided on the lowersurface of the power supply unit 10. The charging terminal 43 is, forexample, a receptacle into which a mating plug (not shown) can beinserted. As the charging terminal 43, a receptacle into which variousUSB terminals (plugs) or the like can be inserted can be used. As anexample, in the present embodiment, the charging terminal 43 is a USBType-C shaped receptacle. Accordingly, it is possible to facilitatecharging of the power supply unit 10 (that is, the aerosol inhaler 1) atvarious locations (places) and secure an opportunity capable of chargingthe power supply unit 10.

The charging terminal 43 may include, for example, a power receptioncoil, and may be configured to be able to receive power transmitted fromthe external power supply in a non-contact manner. A wireless powertransfer method in this case may be an electromagnetic induction type, amagnetic resonance type, or a combination of the electromagneticinduction type and the magnetic resonance type. As another example, thecharging terminal 43 can be connected to various USB terminals or thelike and may include the power reception coil described above.

The internal holder 13 includes a rear wall 13 r that extends along therear surface of the power supply unit 10, a central wall 13 c that isprovided at a central portion in the front-rear direction inside thecase and extends parallel to the rear wall 13 r, an upper wall 13 u thatextends along the display 16 and couples the rear wall 13 r to thecentral wall 13 c, a partition wall 13 d that is orthogonal to the rearwall 13 r, the central wall 13 c, and the upper wall 13 u and divides aspace partitioned and formed by the rear wall 13 r, the central wall 13c, and the upper wall 13 u into a left side space and a right sidespace, and a cartridge holding portion 13 a coupled to the central wall13 c and positioned in front of the central wall 13 c and above thelower surface of the power supply unit 10.

The power supply 12 is disposed in the left side space of the internalholder 13. The power supply 12 is a rechargeable secondary battery, anelectric double-layer capacitor, or the like, and is preferably alithium-ion secondary battery. An electrolyte of the power supply 12 maybe one of or a combination of a gel-like electrolyte, an electrolyticsolution, a solid electrolyte, and an ionic liquid. In the presentembodiment, an output voltage of the power supply 12 when the powersupply 12 is in a fully charged state (hereinafter, also referred to asa fully charged voltage) is 4.2 [V]. The output voltage of the powersupply 12 decreases as a remaining capacity of the power supply 12decreases. Then, the power supply 12 stops discharging when the outputvoltage reaches a predetermined end-of-discharging voltage. Here, theend-of-discharging voltage is a voltage lower than 4.2 [V], which is thefully charged voltage, and can be, for example, about 3 [V]. A statewhere discharging is stopped when the output voltage reaches theend-of-discharging voltage is hereinafter also referred to as anend-of-discharging state.

The substantially L-shaped circuit board 60 is disposed in a spaceformed by the right side space of the internal holder 13 and a lowerside space formed between the cartridge holding portion 13 a and thelower surface of the power supply unit 10. The circuit board 60 has thesubstantially L shape, so that other components can be arranged in acutout portion of the circuit board 60. Therefore, the power supply unit10 and the aerosol inhaler 1 can be miniaturized. In the presentembodiment, as shown in FIGS. 2 and 3, the first cartridge 20 (that is,an aerosol source 22 and a load 21 that will be described later), acartridge holder 14 that holds the first cartridge 20, and the like arearranged in the cutout portion of the substantially L-shaped circuitboard 60. That is, the power supply unit case 11 houses the firstcartridge 20 and the like in a state where the first cartridge 20 andthe like are arranged in the cutout portion of the L-shaped circuitboard 60. Accordingly, the aerosol inhaler 1 can be miniaturized, andfor example, the aerosol inhaler 1 having the size that fits in a handof a general adult can be implemented.

The circuit board 60 is configured by stacking a plurality of layers(four layers in the present embodiment) of boards, and electroniccomponents (elements) such as the micro controller unit (MCU) 50 and acharging IC 55, which will be described later, are mounted on thecircuit board 60.

Although details will be described later with reference to FIG. 5 andthe like, the MCU 50 is a control device (a controller) that isconnected to various sensor devices such as the intake sensor 15 thatdetects a puff (intake) operation, the operation unit 18, a notificationunit 45, a memory 19 that stores number of times of puff operations, anenergization time to the load 21, or the like, and the like, and thatperforms various controls of the aerosol inhaler 1. Specifically, theMCU 50 is mainly configured with a processor, and further includes astorage medium such as a random access memory (RAM) required for anoperation of the processor and a read only memory (ROM) that storesvarious pieces of information. The processor in the present descriptionis, for example, an electric circuit in which circuit elements such assemiconductor elements are combined. Some of the elements (for example,the intake sensor 15 and the memory 19) connected to the MCU 50 in FIG.5 may be provided inside the MCU 50 as a function of the MCU 50 itself.

The charging IC 55 is an integrated circuit (IC) that controls chargingof the power supply 12 by power input from the charging terminal 43 andthat supplies power of the power supply 12 to the electronic componentsand the like of the circuit board 60.

A cylindrical cartridge holder 14 that holds the first cartridge 20 isdisposed at the cartridge holding portion 13 a.

A through hole 13 b, which receives the discharging terminal 41 (seeFIG. 3) provided so as to protrude from the circuit board 60 toward thefirst cartridge 20, is provided in a lower end portion of the cartridgeholding portion 13 a. The discharging terminal 41 is a connector thatelectrically connects the load 21 provided in the first cartridge 20.Further, the discharging terminal 41 is a connector that removably (oreasily removably) connects the load 21, and is configured with, forexample, a pin or the like in which a spring is built.

The through hole 13 b is larger than the discharging terminal 41, and isconfigured such that air flows into an inside of the first cartridge 20via a gap formed between the through hole 13 b and the dischargingterminal 41.

The intake sensor 15 that detects a puff operation is provided on anouter peripheral surface 14 a of the cartridge holder 14 at a positionfacing the circuit board 60. The intake sensor 15 may be configured witha condenser microphone, a pressure sensor, or the like. Further, thecartridge holder 14 is provided with a hole portion 14 b that is long inthe upper-lower direction and through which a remaining amount of theaerosol source 22 stored inside the first cartridge 20 can be visuallychecked, and is configured such that the user can visually check theremaining amount of the aerosol source 22 stored inside the firstcartridge 20 through the hole portion 14 b of the first cartridge 20from a remaining amount check window 11 w that has light-transmissiveproperties and is provided in the power supply unit case 11.

As shown in FIG. 3, the mouthpiece 17 is detachably fixed to an upperend portion of the cartridge holder 14. The second cartridge 30 isdetachably fixed to the mouthpiece 17. The mouthpiece 17 includes acartridge housing portion 17 b that houses a part of the secondcartridge 30, and a communication path 17 c that allows the firstcartridge 20 and the cartridge housing portion 17 b to communicate witheach other.

The power supply unit case 11 is provided with air intake ports 11 ithat take in outside air inside. The air intake port 11 i is providedin, for example, the remaining amount check window 11 w.

(First Cartridge)

As shown in FIG. 3, the first cartridge 20 includes, inside acylindrical cartridge case 27, a reservoir 23 that stores the aerosolsource 22, an electrical load 21 that atomizes the aerosol source 22, awick 24 that draws the aerosol source from the reservoir 23 to the load21, and an aerosol flow path 25 through which an aerosol generated byatomizing the aerosol source 22 flows toward the second cartridge 30.

The reservoir 23 is an example of a storage portion in the presentinvention, is partitioned and formed so as to surround a periphery ofthe aerosol flow path 25, and stores the aerosol source 22. Thereservoir 23 may house a porous body such as a resin web or cotton, andthe aerosol source 22 may be impregnated with the porous body. Thereservoir 23 may store only the aerosol source 22 without housing theporous body on the resin web or the cotton. The aerosol source 22contains a liquid such as glycerin, propylene glycol, or water.

The wick 24 is an example of a transport portion in the presentinvention, and is a liquid holding member that draws the aerosol source22 from the reservoir 23 to the load 21 by using a capillary phenomenon.The wick 24 is made of, for example, glass fiber, porous ceramic, or thelike.

The load 21 is a heat generation element (that is, a heater) that heatsthe aerosol source 22 without burning by power supplied from the powersupply 12 via the discharging terminal 41, and is configured with, forexample, an electric heating wire (a coil) wound at a predeterminedpitch. The load 21 heats the aerosol source 22 to atomize the aerosolsource 22. As the load 21, a heat generation resistor, a ceramic heater,an induction heating type heater, or the like can be used. The load 21is an example of a heater in the present invention.

The aerosol flow path 25 is provided on a downstream side of the load 21and on a center line of the first cartridge 20.

(Second Cartridge)

The second cartridge 30 stores a flavor source 31. The second cartridge30 is detachably housed in the cartridge housing portion 17 b providedin the mouthpiece 17.

The second cartridge 30 adds a flavor to an aerosol by passing theaerosol generated by atomizing the aerosol source 22 by the load 21through the flavor source 31. As a raw material piece that constitutesthe flavor source 31, chopped tobacco or a molded body obtained bymolding a tobacco raw material into a granular shape can be used. Theflavor source 31 may be formed of a plant other than the tobacco (forexample, mint, Chinese herb or herb). A fragrance such as menthol may beadded to the flavor source 31.

The aerosol inhaler 1 can generate (that is, produce) an aerosol towhich a flavor is added by the aerosol source 22, the flavor source 31,and the load 21. That is, the aerosol source 22 and the flavor source 31constitute an aerosol generation source that generates the aerosol towhich the flavor is added.

The configuration of the aerosol generation source used for the aerosolinhaler 1 may be a configuration in which the aerosol source 22 and theflavor source 31 are integrally formed, a configuration in which theflavor source 31 is omitted and a substance that can be contained in theflavor source 31 is added to the aerosol source 22, a configuration inwhich a medicine or the like instead of the flavor source 31 is added tothe aerosol source 22, or the like, in addition to the configuration inwhich the aerosol source 22 and the flavor source 31 are formedseparately.

In the aerosol inhaler 1 configured as described above, as indicated byan arrow A in FIG. 3, air that flows in from the air intake ports 11 iprovided in the power supply unit case 11 passes through a vicinity ofthe load 21 of the first cartridge 20 via the gap formed between thethrough hole 13 b and the discharging terminal 41. The load 21 atomizesthe aerosol source 22 drawn from the reservoir 23 by the wick 24. Theaerosol generated by atomization flows through the aerosol flow path 25together with the air that flows in from the intake ports, and issupplied to the second cartridge 30 via the communication path 17 c. Theaerosol supplied to the second cartridge 30 is flavored by passingthrough the flavor source 31, and is supplied to a suction port 32.

The aerosol inhaler 1 is provided with the notification unit 45 thatnotifies various pieces of information (see FIG. 5). The notificationunit 45 may be configured with a light-emitting element, a vibrationelement, or a sound output element. Further, the notification unit 45may be a combination of two or more elements among the light-emittingelement, the vibration element, and the sound output element. Thenotification unit 45 may be provided in any one of the power supply unit10, the first cartridge 20, and the second cartridge 30, but ispreferably provided in the power supply unit 10 that is not a consumableitem.

In the present embodiment, an organic light emitting diode (OLED) panel46 and a vibrator 47 are provided as the notification unit 45. When anOLED of the OLED panel 46 emits light, various pieces of information onthe aerosol inhaler 1 are notified to the user via the display 16.Further, the vibrator 47 vibrates, so that the user is notified of thevarious pieces of information on the aerosol inhaler 1 via the powersupply unit case 11. The notification unit 45 may be provided with onlyone of the OLED panel 46 and the vibrator 47, or may be provided withanother light-emitting element or the like. Further, informationnotified by the OLED panel 46 and information notified by the vibrator47 may be different or the same.

(Electric Circuit)

Next, an electric circuit of the power supply unit 10 will be describedwith reference to FIG. 4. As shown in FIG. 4, the power supply unit 10includes, as main components, the power supply 12, the charging terminal43, the MCU 50, the charging IC 55, a protection IC 61, an LDO regulator(indicated by “LDO” in FIG. 4) 62, a first DC/DC converter (indicated by“first DC/DC” in FIG. 4) 63, a second DC/DC converter (indicated by“second DC/DC” in FIG. 4) 64, a display driver 65, the intake sensor 15,the OLED panel 46, and the vibrator 47.

The charging terminal 43 is the receptacle into which the mating plugcan be inserted as described above, and includes a plurality of pins(terminals) electrically connected to a pin of the inserted plug.Specifically, the charging terminal 43 includes an A1 pin (indicated by“A1” in FIG. 4), an A4 pin (indicated by “A4” in FIG. 4), an A5 pin(indicated by “A5” in FIG. 4), an A6 pin (indicated by “A6” in FIG. 4),an A7 pin (indicated by “A7” in FIG. 4), an A8 pin (indicated by “A8” inFIG. 4), an A9 pin (indicated by “A9” in FIG. 4), an A12 pin (indicatedby “A12” in FIG. 4), a B1 pin (indicated by “B 1” in FIG. 4), a B4 pin(indicated by “B4” in FIG. 4), a B5 pin (indicated by “B5” in FIG. 4), aB6 pin (indicated by “B6” in FIG. 4), a B7 pin (indicated by “B7” inFIG. 4), a B8 pin (indicated by “B8” in FIG. 4), a B9 pin (indicated by“B9” in FIG. 4), and a B12 pin (indicated by “B12” in FIG. 4).

The A1 pin, the A4 pin, the A5 pin, the A6 pin, the A7 pin, the A8 pin,the A9 pin, the A12 pin, the B1 pin, the B4 pin, the B5 pin, the B6 pin,the B7 pin, the B8 pin, the B9 pin, and the B12 pin are arranged so asto be point-symmetrical, with a center of a fitting surface with a plugof the charging terminal 43 as a point of symmetry. Accordingly, theplug can be inserted into the charging terminal 43 regardless of frontand back directions of the plug, and user convenience is improved.

It should be noted that, in the present embodiment, only main pins amongpins provided in the charging terminal 43 are described. Further, in thepresent embodiment, the charging terminal 43 is provided with the A8 pinand the B8 pin, but as will be described later, these pins are not usedand may be omitted.

The protection IC 61 is an IC having a function of converting a voltageinput via the charging terminal 43 into a predetermined voltage asnecessary and outputting the converted voltage. Specifically, theprotection IC 61 converts the input voltage into a voltage included in arange from a minimum value to a maximum value of a recommended inputvoltage of the charging IC 55. Accordingly, even when a high voltagethat exceeds the maximum value of the recommended input voltage of thecharging IC 55 is input via the charging terminal 43, the protection IC61 can protect the charging IC 55 from the high voltage.

As an example, in the present embodiment, the recommended input voltageof the charging IC 55 has a minimum value of 4.35 [V] and a maximumvalue of 6.4 [V]. Therefore, the protection IC 61 converts the inputvoltage into 5.5±0.2 [V] and outputs the converted voltage to thecharging IC 55. Accordingly, the protection IC 61 can supply anappropriate voltage to the charging IC 55. Further, when theabove-described high voltage is input via the charging terminal 43, theprotection IC 61 may protect the charging IC 55 by opening a circuitthat connects an input terminal (indicated by “IN” in FIG. 4) and anoutput terminal (indicated by “OUT” in FIG. 4) of the protection IC 61.In addition, the protection IC 61 may also have various protectionfunctions (for example, an overcurrent detection function and anovervoltage detection function) for protecting the electric circuit ofthe power supply unit 10.

It is preferable that the protection IC 61 is connected between thecharging terminal 43 and the charging IC 55, that is, is electricallyprovided between the charging terminal 43 and the charging IC 55. Theprotection IC 61 is connected between the charging terminal 43 and thecharging IC 55, so that the power supply 12 can be discharged via thecharging IC 55 without passing through the protection IC 61, and powerloss due to passing through the protection IC 61 can be reduced.

The protection IC 61 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the protection IC61. Specifically, the protection IC 61 includes an IN pin (indicated by“IN” in FIG. 4), a VSS pin (indicated by “VSS” in FIG. 4), a GND pin(indicated by “GND” in FIG. 4), an OUT pin (indicated by “OUT” in FIG.4), a VBAT pin (indicated by “VBAT” in FIG. 4), and a CE pin (indicatedby “CE” in FIG. 4).

In the protection IC 61, the IN pin is a pin to which power suppliedfrom the charging terminal 43 is input. The VSS pin is a pin to whichpower for operating the protection IC 61 is input. The GND pin is agrounded pin. The OUT pin is a pin that outputs power to the charging IC55. The VBAT pin is a pin for the protection IC 61 to detect a state ofthe power supply 12. The CE pin is a pin for switching the protectionfunction of the protection IC 61 on/off. A connection relationship ofthese pins will be described later. It should be noted that, in thepresent embodiment, only main pins among pins provided in the protectionIC 61 are described.

The charging IC 55 is an IC having a function of controlling charging tothe power supply 12 and a function of supplying the power of the powersupply 12 to the LDO regulator 62, the first DC/DC converter 63, thesecond DC/DC converter 64, and the like. For example, when supplying thepower of the power supply 12, the charging IC 55 outputs a standardsystem voltage corresponding to an output of the power supply 12 at thattime to the LDO regulator 62, the first DC/DC converter 63, the secondDC/DC converter 64, and the like. Here, the standard system voltage is avoltage equal to or higher than a low-voltage system voltage describedlater and equal to or lower than the first high-voltage system voltageand the second high-voltage system voltage. The standard system voltageis, for example, an output voltage of the power supply 12 itself, andcan be a voltage of about 3 to 4.2 [V].

The charging IC 55 also has a power-path function of supplying powerinput via the charging terminal 43 to the LDO regulator 62, the firstDC/DC converter 63, the second DC/DC converter 64, and the like.

When the power-path function is used, even when the power supply 12 isbeing charged, power input via the charging terminal 43 can be suppliedto a system of the power supply unit 10, such as the LDO regulator 62,the first DC/DC converter 63, and the second DC/DC converter 64.Therefore, when the system of the power supply unit 10 is used whilecharging the power supply 12, the system of the power supply unit 10 canbe used while reducing a burden on the power supply 12 (that is,preventing deterioration of the power supply 12). At the same time, itis also possible to improve a charging speed of the power supply 12 andshorten a charging time. Further, when the power-path function is used,even when the power supply 12 is over-discharged, it is possible torecover the system of the power supply unit 10 by using power input viathe charging terminal 43.

The charging IC 55 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the charging IC 55.Specifically, the charging IC 55 includes an IN pin (indicated by “IN”in FIG. 4), a BAT_1 pin (indicated by “BAT_1” in FIG. 4), a BAT_2 pin(indicated by “BAT_2” in FIG. 4), an ISET pin (indicated by “ISET” inFIG. 4), a TS pin (indicated by “TS” in FIG. 4), an OUT_1 pin (indicatedby “OUT_1” in FIG. 4), an OUT_2 pin (indicated by “OUT_2” in FIG. 4), anILIM pin (indicated by “ILIM” in FIG. 4), and a CHG pin (indicated by“CHG” in FIG. 4).

It should be noted that, in the present embodiment, only main pins amongpins provided in the charging IC 55 are described. Further, in thepresent embodiment, the charging IC 55 is provided with the BAT_1 pinand the BAT_2 pin, but the BAT_1 pin and the BAT_2 pin may be combinedas one pin. Similarly, in the present embodiment, the charging IC 55 isprovided with the OUT_1 pin and the OUT_2 pin, but the OUT_1 pin and theOUT_2 pin may be combined as one pin.

The LDO regulator 62 is an IC having a function of generating alow-voltage system voltage from an input standard system voltage andoutputting the generated low-voltage system voltage. Here, thelow-voltage system voltage is a voltage equal to or lower than thestandard system voltage as described above, and is, for example, avoltage lower than the standard system voltage and suitable for causingthe MCU 50, the intake sensor 15, and the like to operate. An example ofthe low-voltage system voltage is 2.5 [V].

The LDO regulator 62 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the LDO regulator62. Specifically, the LDO regulator 62 includes an IN pin (indicated by“IN” in FIG. 4), a GND pin (indicated by “GND” in FIG. 4), an OUT pin(indicated by “OUT” in FIG. 4), and an EN pin (indicated by “EN” in FIG.4). It should be noted that, in the present embodiment, only main pinsamong pins provided in the LDO regulator 62 are described.

The MCU 50 operates using the input low-voltage system voltage as apower supply, and performs various controls of the aerosol inhaler 1.For example, the MCU 50 can control heating of the load 21 bycontrolling on/off of a switch SW4 described later and provided in theelectric circuit of the power supply unit 10 and an operation of thefirst DC/DC converter 63. Further, the MCU 50 can control a display ofthe display 16 by controlling an operation of the display driver 65.Furthermore, the MCU 50 can control vibration of the vibrator 47 bycontrolling on/off of a switch SW3 described later and provided in theelectric circuit of the power supply unit 10.

The MCU 50 includes a plurality of pins (terminals) for electricallyconnecting an inside and an outside of the MCU 50. Specifically, the MCU50 includes a VDD pin (indicated by “VDD” in FIG. 4), a VDD_USB pin(indicated by “VDD_USB” in FIG. 4), a VSS pin (indicated by “VSS” inFIG. 4), a PC1 pin (indicated by “PC1” in FIG. 4), a PA8 pin (indicatedby “PA8” in FIG. 4), a PB3 pin (indicated by “PB3” in FIG. 4), a PB15pin (indicated by “PB15” in FIG. 4), a PB4 pin (indicated by “PB4” inFIG. 4), a PC6 pin (indicated by “PC6” in FIG. 4), a PA0 pin (indicatedby “PA0” in FIG. 4), a PC5 pin (indicated by “PC5” in FIG. 4), a PA11pin (indicated by “PA11” in FIG. 4), a PA12 pin (indicated by “PA12” inFIG. 4), a PC12 pin (indicated by “PC12” in FIG. 4), a PB8 pin(indicated by “PB8” in FIG. 4), and a PB9 pin (indicated by “PB9” inFIG. 4).

It should be noted that, in the present embodiment, only main pins amongpins provided in the MCU 50 are described. Further, in the presentembodiment, the MCU 50 is provided with the VDD pin and the VDD_USB pin,but the VDD pin and the VDD_USB pin may be combined as one pin.

The intake sensor 15 is a sensor device that detects a puff operation asdescribed above, and is, for example, a sensor device configured tooutput a signal indicating a value of a change in a pressure (aninternal pressure) in the power supply unit 10 caused by suction of theuser through the suction port 32 as a detection result as will bedescribed later.

The intake sensor 15 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the intake sensor15. Specifically, the intake sensor 15 includes a VCC pin (indicated by“VCC” in FIG. 4), a GND pin (indicated by “GND” in FIG. 4), and an OUTpin (indicated by “OUT” in FIG. 4). It should be noted that, in thepresent embodiment, only main pins among pins provided in the intakesensor 15 are described.

The vibrator 47 is provided in a state of being connected to a positiveelectrode side terminal 47 a provided on a power supply line 60E and toa negative electrode side terminal 47 b provided on a ground line 60N tobe described later, and includes a motor (not shown) that rotates arotation shaft according to a voltage input via the positive electrodeside terminal 47 a and the negative electrode side terminal 47 b, and aneccentric weight (not shown) attached to the rotation shaft of themotor. When a voltage (for example, a low-voltage system voltage) isinput to the vibrator 47 via the positive electrode side terminal 47 aand the negative electrode side terminal 47 b, the motor and theeccentric weight are rotated to generate vibration.

In the present description, the term “positive electrode side” means ahigher potential side than the “negative electrode side”. That is, inthe following description, the term “positive electrode side” may beread as “high potential side”. Further, in the present description, theterm “negative electrode side” means a lower potential side than the“positive electrode side”. That is, in the following description, theterm “negative electrode side” may be read as “low potential side”.

The vibrator 47 is provided in a state of being attached to the powersupply unit 10. The positive electrode side terminal 47 a and thenegative electrode side terminal 47 b are connected to a terminal of thevibrator 47 by, for example, soldering. That is, the positive electrodeside terminal 47 a and the negative electrode side terminal 47 b areconnectors that connect the vibrator 47 such that the vibrator 47 isunremovable (or is difficult to be removed). The term unremovable (ordifficult to be removed) refers to a mode in which the power supply unit10 cannot be removed as long as the power supply unit 10 is assumed tobe used.

The first DC/DC converter 63 is an example of a boost converter in thepresent invention, and is an IC having a function of generating a firsthigh-voltage system voltage from an input standard system voltage andoutputting the generated first high-voltage system voltage. Here, thefirst high-voltage system voltage is a voltage equal to or higher thanthe standard system voltage as described above and can be, for example,a voltage higher than the standard system voltage. That is, the firstDC/DC converter 63 boosts the input standard system voltage to the firsthigh-voltage system voltage and outputs the first high-voltage systemvoltage. The first high-voltage system voltage is, for example, avoltage suitable for heating the load 21, and specifically, can be avoltage included in a range of 4.0 [V] or higher and 4.5 [V] or lower.More specifically, the first high-voltage system voltage can be avoltage included in a range of 4.0 [V] or higher and 4.2 [V] or lower,and can be 4.2 [V] as an example.

The first DC/DC converter 63 includes a plurality of pins (terminals)for electrically connecting an inside and an outside of the first DC/DCconverter 63. Specifically, the first DC/DC converter 63 includes a VINpin (indicated by “VIN” in FIG. 4), an SW pin (indicated by “SW” in FIG.4), a GND pin (indicated by “GND” in FIG. 4), a VOUT pin (indicated by“VOUT” in FIG. 4), a MODE pin (indicated by “MODE” in FIG. 4), and an ENpin (indicated by “EN” in FIG. 4). It should be noted that, in thepresent embodiment, only main pins among pins provided in the firstDC/DC converter 63 are described.

The second DC/DC converter 64 is an IC having a function of generating asecond high-voltage system voltage from an input standard system voltageand outputting the generated second high-voltage system voltage. Here,the second high-voltage system voltage is a high voltage equal to orhigher than the standard system voltage as described above, and can be,for example, a voltage higher than the standard system voltage. That is,the second DC/DC converter 64 boosts the input standard system voltageto the second high-voltage system voltage and outputs the secondhigh-voltage system voltage. Further, the second high-voltage systemvoltage can be a voltage further higher than the first high-voltagesystem voltage, and is, for example, a voltage suitable for causing theOLED panel 46 to operate. Specifically, the second high-voltage systemvoltage is, for example, about 10 [V] to 15 [V].

The second DC/DC converter 64 includes a plurality of pins (terminals)for electrically connecting an inside and an outside of the second DC/DCconverter 64. Specifically, the second DC/DC converter 64 includes a VINpin (indicated by “VIN” in FIG. 4), an SW pin (indicated by “SW” in FIG.4), a GND pin (indicated by “GND” in FIG. 4), a VOUT pin (indicated by“VOUT” in FIG. 4), and an EN pin (indicated by “EN” in FIG. 4). Itshould be noted that, in the present embodiment, only main pins amongpins provided in the second DC/DC converter 64 are described.

The display driver 65 is an IC having a function of operating by usingan input low-voltage system voltage as a power supply, and supplying asecond high-voltage system voltage to the OLED panel 46 whilecontrolling the OLED panel 46 so as to control a display of the display16.

The display driver 65 includes a plurality of pins (terminals) forelectrically connecting an inside and an outside of the display driver65. Specifically, the display driver 65 includes a VDD pin (indicated by“VDD” in FIG. 4), a VSS pin (indicated by “VSS” in FIG. 4), a VCC_C pin(indicated by “VCC_C” in FIG. 4), an SDA pin (indicated by “SDA” in FIG.4), an SCL pin (indicated by “SCL” in FIG. 4), and an IXS pin (indicatedby “IXS” in FIG. 4). It should be noted that, in the present embodiment,only main pins among pins provided in the display driver 65 aredescribed.

The components of the power supply unit 10 described above areelectrically connected to one another by a lead wire or the likeprovided on the circuit board 60 of the power supply unit 10.Hereinafter, electrical connection of the components of the power supplyunit 10 will be described in detail.

The A1 pin, the A12 pin, the B1 pin, and the B12 pin of the chargingterminal 43 are ground pins. The A1 pin and the B12 pin are connected inparallel and grounded by the ground line 60N. Similarly, the A12 pin andthe B1 pin are also connected in parallel and grounded by the groundline 60N. In FIG. 4, the ground line 60N (that is, a line having apotential of substantially 0 [V]) is indicated by a thick solid line.

The A4 pin, the A9 pin, the B4 pin, and the B9 pin of the chargingterminal 43 are pins that receive an input of power from a plug of anexternal power supply inserted into the charging terminal 43 to thepower supply unit 10. For example, when the plug is inserted into thecharging terminal 43, predetermined USB bus power is supplied to thepower supply unit 10 from the inserted plug via the A4 pin and the B9pin, or the A9 pin and the B4 pin. Further, power corresponding to USBpower delivery (USB PD) may be supplied to the power supply unit 10 fromthe plug of the external power supply inserted into the chargingterminal 43.

Specifically, the A4 pin and the B9 pin are connected in parallel andconnected to the IN pin of the protection IC 61 via the power supplyline 60A. The IN pin of the protection IC 61 is a power supply pin ofthe protection IC 61 on a positive electrode side. Further, the A9 pinand the B4 pin are also connected in parallel and connected to the INpin of the protection IC 61 via the power supply line 60A.

The power supply line 60A is connected to the ground line 60N via avariable resistor (a nonlinear resistance element) VR1. Here, thevariable resistor is an element that includes two terminals(electrodes), has a relatively high electric resistance value when avoltage between the two terminals is lower than a predetermined variableresistor voltage (for example, 27 [V] in a case of the presentembodiment), and has a property in which the electric resistance valuerapidly decreases when the voltage between the two terminals is equal toor higher than the variable resistor voltage.

Specifically, one end of the variable resistor VR1 is connected to anode N11 provided in the power supply line 60A, and the other end of thevariable resistor VR1 is connected to the ground line 60N. Here, thenode N11 is provided in the power supply line 60A on a protection IC 61side with respect to a node connected to the A4 pin and the B9 pin and anode connected to the A9 pin and the B4 pin. Therefore, for example,even when static electricity is generated in the A4 pin, the A9 pin, theB4 pin, or the B9 pin due to friction between the charging terminal 43and the plug when the plug is inserted into the charging terminal 43,the static electricity can be released to the ground line 60N via thevariable resistor VR1 to protect the protection IC 61.

The power supply line 60A is connected to the ground line 60N via acapacitor CD1 that functions as a decoupling capacitor (also referred toas a bypass capacitor or a smoothing capacitor). Accordingly, a voltageinput to the protection IC 61 via the power supply line 60A can bestabilized. Specifically, one end of the capacitor CD1 is connected to anode N12 provided in the power supply line 60A, and the other end of thecapacitor CD1 is connected to the ground line 60N. Here, the node N12 isprovided in the power supply line 60A on the protection IC 61 side withrespect to the node N11. Therefore, even when static electricity isgenerated at the A4 pin, the A9 pin, the B4 pin, or the B9 pin, thevariable resistor VR1 can protect the capacitor CD1 from the staticelectricity. That is, in the power supply line 60A, by providing thenode N12 on the protection IC 61 side with respect to the node N11, itis possible to achieve both protection of the protection IC 61 fromovervoltage and a stable operation of the protection IC 61.

The A6 pin, the A7 pin, the B6 pin, and the B7 pin of the chargingterminal 43 are pins used for input and output of a signal forcommunication between the power supply unit 10 and an externalapparatus. In the present embodiment, serial communication in whichsignals are transmitted differentially by two signal lines Dp (alsoreferred to as D+) and Dn (also referred to as D−) is used forcommunication between the power supply unit 10 and the externalapparatus.

The A6 pin and the B6 pin are pins corresponding to a signal line on aDp side. The A6 pin and the B6 pin are connected in parallel and areconnected to the PA12 pin of the MCU 50 via a resistor R1. The resistorR1 is an element that is configured with a resistance element, atransistor, or the like and has a predetermined electric resistancevalue. Further, the PA12 pin of the MCU 50 is a pin used for input andoutput of a signal of the MCU 50. Therefore, a signal on the Dp sidefrom the external apparatus can be input to the MCU 50 via the A6 pin orthe B6 pin. Further, the signal on the Dp side from the MCU 50 can beoutput to the external apparatus via the A6 pin or the B6 pin.

The A6 pin and the B6 pin connected in parallel are also connected tothe ground line 60N via a variable resistor VR2. That is, the variableresistor VR2 is connected in parallel to the A6 pin and the B6 pinconnected in parallel. Therefore, for example, even when staticelectricity is generated in the A6 pin and the B6 pin due to thefriction between the charging terminal 43 and the plug when the plug isinserted into the charging terminal 43, the static electricity can bereleased to the ground line 60N via the variable resistor VR2 to protectthe MCU 50. Further, since the resistor R1 is provided between the pinsA6 and B6 and the MCU 50, the resistor R1 can also prevent input of ahigh voltage to the MCU 50 and protect the MCU 50.

The A7 pin and the B7 pin are pins corresponding to a signal line on aDn side. The A7 pin and the B7 pin are connected in parallel andconnected to the PA11 pin of the MCU 50 via a resistor R2. The resistorR2 is an element that is configured with a resistance element, atransistor, or the like and has a predetermined electric resistancevalue. Further, the PA11 pin of the MCU 50 is a pin used for input andoutput of a signal of the MCU 50. Therefore, a signal on the Dn sidefrom the external apparatus can be input to the MCU 50 via the A7 pin orthe B7 pin. Further, a signal on the Dn side from the MCU 50 can beoutput to the external apparatus via the A7 pin or the B7 pin.

The A7 pin and the B7 pin connected in parallel are also connected tothe ground line 60N via a variable resistor VR3. That is, the variableresistor VR3 is connected in parallel to the A7 pin and the B7 pinconnected in parallel. Therefore, for example, even when staticelectricity is generated in the A7 pin or the B7 pin due to the frictionbetween the charging terminal 43 and the plug when the plug is insertedinto the charging terminal 43, the static electricity can be released tothe ground line 60N via the variable resistor VR3 to protect the MCU 50.Further, since the resistor R2 is provided between the pins A7 and B7and the MCU 50, the resistor R2 can also prevent input of a high voltageto the MCU 50 and protect the MCU 50.

The A5 pin and the B5 pin of the charging terminal 43 are pins used todetect an upper-lower direction of the plug inserted into the chargingterminal 43. For example, the A5 pin and the B5 pin are configurationchannel (CC) pins. The A5 pin is connected to the ground line 60N viathe resistor R3, and the B5 pin is connected to the ground line 60N viaa resistor R4.

The A8 pin and the B8 pin of the charging terminal 43 are not connectedto the electric circuit of the power supply unit 10. Therefore, the A8pin and the B8 pin are not used and may also be omitted.

As described above, the IN pin of the protection IC 61 is the powersupply pin of the protection IC 61 on the positive electrode side and isconnected to the power supply line 60A. The VSS pin of the protection IC61 is a power supply pin of the protection IC 61 on a negative electrodeside and is connected to the ground line 60N. Further, the GND pin ofthe protection IC 61 is a ground pin of the protection IC 61 and isconnected to the ground line 60N. Accordingly, when the plug of theexternal power supply is inserted into the charging terminal 43, power(for example, USB bus power) is supplied to the protection IC 61 via thepower supply line 60A.

The OUT pin of the protection IC 61 is a pin from which a voltage inputto the IN pin of the protection IC 61 is output as it is or a voltage(for example, 5.5±0.2 [V]) converted by the protection IC 61 is output,and is connected to the IN pin of the charging IC 55 via the powersupply line 60B. The IN pin of the charging IC 55 is a power supply pinof the charging IC 55 on a positive electrode side. Accordingly, anappropriate voltage converted by the protection IC 61 is supplied to thecharging IC 55.

The power supply line 60B is connected to the ground line 60N via acapacitor CD2 that functions as a decoupling capacitor. Accordingly, avoltage input to the charging IC 55 via the power supply line 60B can bestabilized.

The VBAT pin of the protection IC 61 is a pin used by the protection IC61 for detecting presence or absence of connection of the power supply12, and is connected to a positive electrode side terminal 12 a of thepower supply 12 via a resistor R5. The resistor R5 is an element that isconfigured with a resistance element, a transistor, or the like and hasa predetermined electric resistance value. The protection IC 61 candetect that the power supply 12 is connected based on a voltage input tothe VBAT pin.

The CE pin of the protection IC 61 is a pin for turning on/off anoperation (various functions) of the protection IC 61. Specifically, theprotection IC 61 operates when a low-level voltage is input to the CEpin, and stops the operation when a high-level voltage is input to theCE pin. In the present embodiment, the CE pin of the protection IC 61 isconnected to the ground line 60N so that the low-level voltage is alwaysinput. Therefore, the protection IC 61 always operates during a supplyof power, and performs conversion to a predetermined voltage,overcurrent detection, overvoltage detection, and the like.

Instead of the protection IC 61 in the present embodiment, a protectionIC that operates when a high-level voltage is input to a CE pin andstops the operation when a low-level voltage is input to the CE pin maybe used. However, in this case, it should be noted that the CE pin ofthe protection IC needs to be connected to the power supply line 60B orthe power supply line 60A instead of the ground line 60N.

As described above, the IN pin of the charging IC 55 is the power supplypin of the charging IC 55 on the positive electrode side, and isconnected to the power supply line 60B. Further, the charging IC 55 isconnected to the ground line 60N by, for example, a power supply pin ona negative electrode side (not shown). Accordingly, a voltage outputfrom the protection IC 61 is supplied to the charging IC 55 via thepower supply line 60B.

The BAT_1 pin and the BAT_2 pin of the charging IC 55 are pins used totransmit and receive power between the charging IC 55 and the powersupply 12, and are connected to the positive electrode side terminal 12a of the power supply 12 via a power supply line 60C. A negativeelectrode side terminal 12 b of the power supply 12 is connected to theground line 60N.

Specifically, the BAT_1 pin and the BAT_2 pin are connected in parallel,connected to the positive electrode side terminal 12 a, and connected tothe ground line 60N via a capacitor CD3. When the power supply 12 isdischarged, electric charge is accumulated in the capacitor CD3, and avoltage output from the power supply 12 is input to the BAT_1 pin andthe BAT_2 pin. Further, when the power supply 12 is charged, a voltagefor charging the power supply 12 is output from the BAT_1 pin and theBAT_2 pin, and is applied to the positive electrode side terminal 12 aof the power supply 12 via the power supply line 60C.

The power supply line 60C is connected to the ground line 60N via acapacitor CD4 that functions as a decoupling capacitor. Accordingly, avoltage input to the power supply 12 via the power supply line 60C canbe stabilized.

The ISET pin of the charging IC 55 is a pin for setting a value of acurrent output from the charging IC 55 to the power supply 12. In thepresent embodiment, the ISET pin is connected to the ground line 60N viaa resistor R6. Here, the resistor R6 is an element that is configuredwith a resistance element, a transistor, or the like and has apredetermined electric resistance value.

The charging IC 55 outputs, to the power supply 12, a current having acurrent value corresponding to an electric resistance value of theresistor R6 connected to the ISET pin.

The TS pin of the charging IC 55 is a pin to which a voltage valueapplied to a resistor connected to the TS pin is input and that is usedto detect an electric resistance value and a temperature of the resistorconnected to the TS pin based on the voltage value. In the presentembodiment, the TS pin is connected to the ground line 60N via aresistor R7. Here, the resistor R7 is an element that is configured witha resistance element, a transistor, or the like and has a predeterminedelectric resistance value. Therefore, the charging IC 55 can detect anelectric resistance value and a temperature of the resistor R7 based ona voltage value applied to the resistor R7.

The CHG pin of the charging IC 55 is a pin that outputs information on acharging state of the power supply 12 (hereinafter, also referred to ascharging state information), such as during charging, during a chargingstop, and charging completion, and information on a remaining capacityof the power supply 12 (hereinafter, also referred to as remainingcapacity information). The CHG pin of the charging IC 55 is connected tothe PB15 pin of the MCU 50. The PB15 pin of the MCU 50 is a pin used toinput a signal of the MCU 50. Therefore, the charging IC 55 can notifythe MCU 50 of the charging state, the remaining capacity, and the likeof the power supply 12 by outputting the charging state information andthe remaining capacity information from the CHG pin to the MCU 50.

For example, when the power supply 12 is in the fully charged state, thecharging IC 55 outputs the remaining capacity information indicatingthat the power supply 12 is in the fully charged state. Here, theremaining capacity information indicating that the power supply 12 is inthe fully charged state may, for example, indicate that the remainingcapacity of the power supply 12 is an upper limit value (for example,100 [%]) or that the output voltage of the power supply 12 is the fullycharged voltage (for example, 4.2 [V]).

When the power supply 12 is in the end-of-discharging state, thecharging IC 55 outputs the remaining capacity information indicatingthat the power supply 12 is in the end-of-discharging state. Here, theremaining capacity information indicating that the power supply 12 is inthe end-of-discharging state may, for example, indicate that theremaining capacity of the power supply 12 is a lower limit value (forexample, 0 [%]) or that the output voltage of the power supply 12 is theend-of-discharging voltage (for example, 3 [V]).

In the present embodiment, the remaining capacity information is inputand output by the same pin as in the charging state information, but thepresent invention is not limited thereto. For example, the pin throughwhich the remaining capacity information is input and output may beprovided separately from the CHG pin of the charging IC 55 and the PB15pin of the MCU 50. Further, instead of the present embodiment, the MCU50 may be configured to directly acquire the remaining capacityinformation.

The OUT_1 pin and the OUT_2 pin of the charging IC 55 are pins fromwhich the standard system voltage is output, and are connected to the INpin of the LDO regulator 62, the VIN pin of the first DC/DC converter63, and the VIN pin of the second DC/DC converter 64 via a power supplyline 60D. The IN pin of the LDO regulator 62 is a power supply pin ofthe LDO regulator 62 on a positive electrode side. Further, the VIN pinof the first DC/DC converter 63 is a power supply pin of the first DC/DCconverter 63 on a positive electrode side. Then, the VIN pin of thesecond DC/DC converter 64 is a power supply pin of the second DC/DCconverter 64 on a positive electrode side.

Specifically, the OUT_1 pin is connected to the ground line 60N and tothe OUT_2 pin via a capacitor CD5 that functions as a decouplingcapacitor. Then, the OUT_1 pin and the OUT_2 pin are connected to theground line 60N via a capacitor CD6 that functions as a decouplingcapacitor, and are connected to the IN pin of the LDO regulator 62, theVIN pin of the first DC/DC converter 63, and the VIN pin of the secondDC/DC converter 64. Accordingly, the charging IC 55 can supply a stablestandard system voltage to the LDO regulator 62, the first DC/DCconverter 63, and the second DC/DC converter 64.

In the present embodiment, a capacitor CD7 that functions as adecoupling capacitor is also provided immediately before the first DC/DCconverter 63 of the power supply line 60D. Accordingly, a stablestandard system voltage can be supplied to the first DC/DC converter 63,and a power supply from the first DC/DC converter 63 to the load 21 canbe stabilized.

The ILIM pin of the charging IC 55 is a pin for setting an upper limitof a value of a current output from the charging IC 55 to the LDOregulator 62, the first DC/DC converter 63, and the second DC/DCconverter 64. In the present embodiment, the ILIM pin is connected tothe ground line 60N via the resistor R7. Here, the resistor R7 is theelement that is configured with the resistance element, the transistor,or the like and has a predetermined electric resistance value.

The charging IC 55 outputs, to the LDO regulator 62, the first DC/DCconverter 63, and the second DC/DC converter 64, a current whose upperlimit is a current value corresponding to the electric resistance valueof the resistor R7 connected to the ILIM pin. More specifically, thecharging IC 55 outputs the current having the current valuecorresponding to the electric resistance value of the resistor R6connected to the ISET pin from the OUT_1 pin and the OUT_2 pin, andstops outputting the current from the OUT_1 pin and the OUT_2 pin whenthe current value reaches a current value corresponding to the electricresistance value of the resistor R7 connected to the ILIM pin. That is,a manufacturer of the aerosol inhaler 1 can set an upper limit value ofthe current output from the charging IC 55 to the LDO regulator 62, thefirst DC/DC converter 63, and the second DC/DC converter 64 by theelectric resistance value of the resistor R7 connected to the ILIM pin.

An LED circuit C1 is provided by branching from the power supply line60D. The LED circuit C1 is configured by connecting a resistor R8, anLED 70, and a switch SW1 in series. Here, the resistor R8 is an elementthat is configured with a resistance element, a transistor, or the likeand has a predetermined electric resistance value. The resistor R8 ismainly used to limit a voltage applied to the LED 70 and/or a currentsupplied to the LED 70. The LED 70 is a light-emitting portion providedat a position corresponding to the remaining amount check window 11 winside the power supply unit 10, and configured to illuminate an outsideof the power supply unit 10 from an inside of the power supply unit 10via the remaining amount check window 11 w. When the LED 70 emits light,visibility of a remaining amount of the first cartridge 20(specifically, a remaining amount of the aerosol source 22 stored in thefirst cartridge 20) via the remaining amount check window 11 w isimproved. The switch SW1 is, for example, a switch configured with aMOSFET or the like.

One end of the LED circuit C1 on a resistor R8 side, that is, one end ofthe resistor R8 is connected to a node N21 provided in the power supplyline 60D. The other end of the resistor R8 constitutes a connector 70 aand is connected to a terminal of the LED 70 on an anode side. One endof the switch SW1 constitutes a connector 70 b and is connected to aterminal of the LED 70 on a cathode side. The other end of the LEDcircuit C1 on a switch SW1 side, that is, the other end of the switchSW1 is connected to the ground line 60N.

The switch SW1 is also connected to the MCU 50 as will be describedlater, is turned on in response to an on command of the MCU 50, and isturned off in response to an off command of the MCU 50. The LED circuitC1 is in a conductive state when the switch SW1 is turned on. Then, theLED 70 emits light when the LED circuit C1 is in the conductive state.

As described above, the IN pin of the LDO regulator 62 is the powersupply pin of the LDO regulator 62 on the positive electrode side, andis connected to the power supply line 60D. The GND pin of the LDOregulator 62 is a ground pin of the LDO regulator 62 and is connected tothe ground line 60N. Accordingly, the standard system voltage outputfrom the charging IC 55 is supplied to the LDO regulator 62 via thepower supply line 60D.

The OUT pin of the LDO regulator 62 is a pin that outputs a low-voltagesystem voltage generated by the LDO regulator 62, and is connected tothe VDD pin and the VDD_USB pin of the MCU 50, the VCC pin of the intakesensor 15, the VDD pin and the IXS pin of the display driver 65, and thepositive electrode side terminal 47 a connected to the vibrator 47 viathe power supply line 60E. The VDD pin and the VDD_USB pin of the MCU 50are power supply pins of the MCU 50 on a positive electrode side.Further, the VCC pin of the intake sensor 15 is a power supply pin ofthe intake sensor 15 on a positive electrode side. Then, the VDD pin ofthe display driver 65 is a power supply pin of the display driver 65 ona positive electrode side. Accordingly, the LDO regulator 62 can supplythe low-voltage system voltage to the MCU 50, the intake sensor 15, thedisplay driver 65, and the vibrator 47.

The EN pin of the LDO regulator 62 is a pin for turning on/off anoperation (a function) of the LDO regulator 62. Specifically, the LDOregulator 62 operates when a high-level voltage is input to the EN pin,and stops the operation when the high-level voltage is not input to theEN pin.

In the present embodiment, the EN pin of the LDO regulator 62 isconnected to the power supply line 60D and also connected to the groundline 60N via a capacitor CD8. Therefore, when the standard systemvoltage is output from the charging IC 55, electric charge isaccumulated in the capacitor CD8, the high-level voltage is input to theEN pin of the LDO regulator 62, the LDO regulator 62 operates, and thelow-voltage system voltage is output from the LDO regulator 62.

That is, in the power supply unit 10, the capacitor CD8 connected to theEN pin of the LDO regulator 62 can be charged by power from the chargingIC 55, and a high-level signal can be input to the EN pin of the LDOregulator 62. Accordingly, even when the LDO regulator 62 and the MCU 50are in a stopped state due to power shortage of the power supply 12, theLDO regulator 62 can be reactivated by power from the external powersupply, and the MCU 50 can also be reactivated by power from the LDOregulator 62.

As described above, the VDD pin and the VDD_USB pin of the MCU 50 arepower supply pins of the MCU 50 on the positive electrode side, and areconnected to the power supply line 60E. The VSS pin of the MCU 50 is apower supply pin of the MCU 50 on a negative electrode side and isconnected to the ground line 60N. Accordingly, a low-voltage systemvoltage output from the LDO regulator 62 is supplied to the MCU 50 viathe power supply line 60E. The VDD pin and the VDD_USB pin may becombined as one pin.

A thermistor circuit C2 is provided by branching from the power supplyline 60E. The thermistor circuit C2 is configured by connecting a switchSW2, a resistor R9, and a thermistor TH in series. One end of thethermistor circuit C2 on a switch SW2 side is connected to a node N31provided in the power supply line 60E. Further, the other end of thethermistor circuit C2 on a thermistor TH side is connected to the groundline 60N.

Here, the switch SW2 is a switch configured with, for example, a MOSFETor the like. The switch SW2 is connected to the MCU 50 as will bedescribed later, is turned on in response to the on command of the MCU50, and is turned off in response to the off command of the MCU 50. Thethermistor circuit C2 is in a conductive state when the switch SW2 isturned on.

The resistor R9 is an element that is configured with a resistanceelement, a transistor, or the like and has a predetermined electricresistance value. The thermistor TH includes an element having negativetemperature coefficient (NTC) characteristics or positive temperaturecoefficient (PTC) characteristics, that is, an element having acorrelation between an electric resistance value and a temperature, andthe like. The thermistor TH is disposed in the vicinity of the powersupply 12 in a state where a temperature of the power supply 12 can bedetected.

The PC1 pin of the MCU 50 is connected to a node N32 provided betweenthe resistor R9 and the thermistor TH in the thermistor circuit C2. Whenthe thermistor circuit C2 is in the conductive state (that is, when theswitch SW2 is turned on), a voltage divided by the resistor R9 and thethermistor TH is input to the PC1 pin. The MCU 50 can detect atemperature of the thermistor TH, that is, the temperature of the powersupply 12, based on a voltage value input to the PC1 pin.

The PA8 pin of the MCU 50 is a pin that is connected to the switch SW2and outputs an on command to turn on the switch SW2 and an off commandto turn off the switch SW2. The MCU 50 can turn on the switch SW2 to putthe thermistor circuit C2 in the conductive state by outputting the oncommand from the PA8 pin. Further, the MCU 50 can turn off the switchSW2 to put the thermistor circuit C2 in a non-conductive state byoutputting the off command from the PA8 pin. As a specific example, whenthe switch SW2 is a switch configured with a MOSFET, the PA8 pin of theMCU 50 is connected to a gate terminal of the MOSFET. Then, the MCU 50can control on/off of the switch SW2 by controlling a gate voltage (thatis, an output from the PA8 pin) applied to the gate terminal.

In the power supply line 60E, the switch SW3 is provided in front of thepositive electrode side terminal 47 a. Here, the switch SW3 is a switchconfigured with, for example, a MOSFET or the like. The switch SW3 isconnected to the MCU 50, is turned on in response to the on command ofthe MCU 50, and is turned off in response to the off command of the MCU50.

Specifically, the PC6 pin of the MCU 50 is a pin that is connected tothe switch SW3 and outputs an on command to turn on the switch SW3 andan off command to turn off the switch SW3. When the on command is outputfrom the PC6 pin, the MCU 50 can turn on the switch SW3, supply power tothe vibrator 47 by the power supply line 60E, and vibrate the vibrator47. Further, when the off command is output from the PC6 pin, the MCU 50can turn off the switch SW3, and stop the supply of power to thevibrator 47 by the power supply line 60E (that is, the vibration of thevibrator 47). As a specific example, when the switch SW3 is a switchconfigured with a MOSFET, the PC6 pin of the MCU 50 is connected to agate terminal of the MOSFET. Then, the MCU 50 can control on/off of theswitch SW3 by controlling a gate voltage (that is, an output from thePC6 pin) applied to the gate terminal.

A Zener diode D is connected to the power supply line 60E. Here, theZener diode is a diode that includes two terminals (electrodes) on ananode side and a cathode side, and in which a current rapidly flows fromthe cathode side to the anode side when a voltage of a terminal on theanode side exceeds a predetermined Zener voltage (also referred to as abreakdown voltage, for example, in a case of the present embodiment, avoltage lower than the variable resistor voltage described above).

Specifically, one end of the Zener diode D on the anode side isconnected to the ground line 60N, and the other end of the Zener diode Don the cathode side is connected to a node N41 provided in the powersupply line 60E. Here, the node N41 is provided between the switch SW3and the positive electrode side terminal 47 a in the power supply line60E. Accordingly, even when a counter-electromotive force having avoltage higher than the Zener voltage of the Zener diode D is generatedfrom the vibrator 47 when the vibrator 47 is turned on/off, as indicatedby an arrow of a reference numeral C3 in FIG. 4, a current due to thecounter-electromotive force can flow through a closed circuit formed bythe vibrator 47 and the Zener diode D. Therefore, it is possible toprevent the current due to the counter-electromotive force from flowingto an outside of the closed circuit formed by the vibrator 47 and theZener diode D, and to protect the electronic components of the powersupply unit 10 such as the power supply 12 and the LDO regulator 62provided outside the closed circuit.

A capacitor CD9 may be connected to the power supply line 60E.Specifically, in this case, one end of the capacitor CD9 is connected toa node N42 provided in the power supply line 60E, and the other end ofthe capacitor CD9 is connected to the ground line 60N. Here, the nodeN42 is provided on a positive electrode side terminal 47 a side withrespect to the node N41 in the power supply line 60E. In this way, thecapacitor CD9 can be disposed in the closed circuit formed by thevibrator 47 and the Zener diode D described above, and the capacitor CD9can also protect the electronic components of the power supply unit 10such as the power supply 12 and the LDO regulator 62 provided outsidethe closed circuit formed by the vibrator 47 and the Zener diode D. Thecapacitor CD9 may not be provided in the closed circuit described above,but may be provided in the vicinity of the closed circuit. As a specificexample, the capacitor CD9 may be provided between the switch SW3 andthe Zener diode D. Even in this way, the capacitor CD9 and the Zenerdiode D can protect the electronic components of the power supply unit10 such as the power supply 12 and the LDO regulator 62.

The PB3 pin of the MCU 50 is a pin that is connected to the EN pin ofthe first DC/DC converter 63 and outputs a predetermined voltage signal.The MCU 50 can turn on/off the operation of the first DC/DC converter 63by the voltage signal output from the PB3 pin. Specifically, the MCU 50can cause the first DC/DC converter 63 to operate (that is, enable thefirst DC/DC converter 63) by outputting a high-level voltage signal fromthe PB3 pin. Further, the MCU 50 can stop the operation of the firstDC/DC converter 63 (that is, disable the first DC/DC converter 63) byoutputting a low-level voltage signal from the PB3 pin.

The PB4 pin of the MCU 50 is a pin that is connected to the switch SW4described later and provided between the first DC/DC converter 63 andthe discharging terminal 41, and that outputs an on command to turn onthe switch SW4 and an off command to turn off the switch SW4. The MCU 50can supply power to the load 21 as will be described later by outputtingthe on command from the PB4 pin to turn on the switch SW4. Further, theMCU 50 can stop the supply of power to the load 21 by outputting the offcommand from the PB4 pin to turn off the switch SW4. As a specificexample, when the switch SW4 is a switch configured with a MOSFET, thePB4 pin of the MCU 50 is connected to a gate terminal of the MOSFET.Then, the MCU 50 can control on/off of the switch SW4 by controlling agate voltage (that is, an output from the PB4 pin) applied to the gateterminal.

As described above, the PB15 pin of the MCU 50 is a pin that isconnected to the CHG pin of the charging IC 55 and receives input of thecharging state information and the remaining capacity information outputfrom the charging IC 55.

The PA0 pin of the MCU 50 is a pin that is connected to the switch SW1of the LED circuit C1 and outputs an on command to turn on the switchSW1 and an off command to turn off the switch SW1. The MCU 50 can putthe LED circuit C1 in a conductive state to cause the LED 70 to emitlight (be turned on) by outputting the on command from the PA0 pin toturn on the switch SW1. Further, the MCU 50 can put the LED circuit C1in a non-conductive state to turn off the LED 70 by outputting the offcommand from the PA0 pin to turn off the switch SW1. As a specificexample, when the switch SW1 is a switch configured with a MOSFET, thePA0 pin of the MCU 50 is connected to a gate terminal of the MOSFET.Then, the MCU 50 can control on/off of the switch SW1 by controlling agate voltage (that is, an output from the PA0 pin) applied to the gateterminal. Further, the MCU 50 can switch between the conductive stateand the non-conductive state of the LED circuit C1 at a high speed tocause the LED 70 to blink by outputting while switching the on commandand the off command from the PA0 pin at a high speed.

The PC5 pin of the MCU 50 is a pin that is connected to the OUT pin ofthe intake sensor 15 and receives an output of the intake sensor 15(that is, a signal indicating a detection result of the intake sensor15).

The PA11 pin and the PA12 pin of the MCU 50 are pins used for input andoutput of a signal for communication between the power supply unit 10and the external apparatus. Specifically, as described above, the PA11pin is connected to the A7 pin and the B7 pin of the charging terminal43 via the resistor R2, and is used for input and output of a signal onthe Dn side. Further, as described above, the PA12 pin is connected tothe A6 pin and the B6 pin of the charging terminal 43 via the resistorR1, and is used for input and output of a signal on the Dp side.

The PC12 pin of the MCU 50 is a pin that is connected to the EN pin ofthe second DC/DC converter 64 and outputs a predetermined voltagesignal. The MCU 50 can turn on/off an operation of the second DC/DCconverter 64 by the voltage signal output from the PC12 pin.Specifically, the MCU 50 can cause the second DC/DC converter 64 tooperate (that is, enable the second DC/DC converter 64) by outputting ahigh-level voltage signal from the PC12 pin. Further, the MCU 50 canstop the operation of the second DC/DC converter 64 (that is, disablethe second DC/DC converter 64) by outputting a low-level voltage signalfrom the PC12 pin.

The PB8 pin and the PB9 pin of the MCU 50 are pins used to output asignal for communication between the MCU 50 and another IC, and are usedfor communication between the MCU 50 and the display driver 65 in thepresent embodiment. Specifically, in the present embodiment, the MCU 50and the display driver 65 perform inter-integrated circuit (I2C)communication. The PB8 pin is used to output a signal of the I2Ccommunication on an SCL side, and the PB9 pin is used to output a signalof the I2C communication on an SDA side. The MCU 50 can control thedisplay driver 65 by the signals output from the PB8 pin and the PB9 pinto control a display content of the display 16 (the OLED panel 46).

As described above, the VCC pin of the intake sensor 15 is the powersupply pin of the intake sensor 15 on the positive electrode side, andis connected to the power supply line 60E. The GND pin of the intakesensor 15 is a ground pin of the intake sensor 15 and is connected tothe ground line 60N. Accordingly, the low-voltage system voltage outputfrom the LDO regulator 62 is supplied to the intake sensor 15 via thepower supply line 60E.

As described above, the OUT pin of the intake sensor 15 is a pin thatoutputs the signal indicating the detection result of the intake sensor15, and is connected to the PC5 pin of the MCU 50. Accordingly, theintake sensor 15 can notify the MCU 50 of the detection result.

As described above, the VIN pin of the first DC/DC converter 63 is thepower supply pin of the first DC/DC converter 63 on the positiveelectrode side, and is connected to the power supply line 60D. Further,the VIN pin of the first DC/DC converter 63 is also connected to the SWpin (the switch pin) of the first DC/DC converter 63 via a coil CL1. TheGND pin of the first DC/DC converter 63 is a ground pin of the firstDC/DC converter 63, and is connected to the ground line 60N.

The VOUT pin of the first DC/DC converter 63 is a pin that outputs thefirst high-voltage system voltage generated by the first DC/DC converter63, and is connected to the positive electrode side discharging terminal41 a of the discharging terminal 41 via a power supply line 60F. Thenegative electrode side discharging terminal 41 b of the dischargingterminal 41 is connected to the ground line 60N.

The power supply line 60F is provided with a switch SW4 that is anexample of a switch in the present invention. The switch SW4 is, forexample, a switch configured with a MOSFET or the like, and morespecifically, is a power MOSFET having a high switching speed. Theswitch SW4 is connected to the MCU 50 as described above, is turned onin response to the on command of the MCU 50, and is turned off inresponse to the off command of the MCU 50. When the switch SW4 is turnedon, the power supply line 60F is in a conductive state, and the firsthigh-voltage system voltage is supplied to the load 21 via the powersupply line 60F.

A variable resistor VR4 is connected to the power supply line 60F.Specifically, one end of the variable resistor VR4 is connected to anode N51 provided in the power supply line 60F, and the other end of thevariable resistor VR4 is connected to the ground line 60N. Here, thenode N51 is provided on a positive electrode side discharging terminal41 a side with respect to the switch SW4, that is, on an output side ofthe switch SW4 in the power supply line 60F. In other words, thevariable resistor VR4 is connected between the discharging terminal 41and the power supply 12, more specifically, between the dischargingterminal 41 and the first DC/DC converter 63 (more specifically, theswitch SW4).

Therefore, for example, even when static electricity is generated in thedischarging terminal 41 due to friction between the discharging terminal41 and the load 21 when the first cartridge 20 is replaced, the staticelectricity can be released to the ground line 60N via the variableresistor VR4 to protect the switch SW4, the first DC/DC converter 63,the power supply 12, and the like. Further, even when the variableresistor VR4 fails, the switch SW4 and the first DC/DC converter 63 canserve as a barrier against noise (in this case, the static electricitygenerated in the discharging terminal 41) for another element (forexample, the charging IC 55) on a power supply 12 side with respect tothe switch SW4 and the first DC/DC converter 63, and can protect anotherelement.

A capacitor CD10 that functions as a decoupling capacitor is connectedto the power supply line 60F. Specifically, one end of the capacitorCD10 is connected to a node N52 provided in the power supply line 60F,and the other end of the capacitor CD10 is connected to the ground line60N. Here, the node N52 is provided between the node N51 and the switchSW4 in the power supply line 60F. In other words, the capacitor CD10 isconnected to the output side of the switch SW4. Accordingly, powersupply from the switch SW4 to the load 21 can be stabilized, and evenwhen static electricity is generated in the discharging terminal 41, thevariable resistor VR4 can protect the capacitor CD10 from the staticelectricity. The capacitor CD10 is an example of a second smoothingcapacitor in the present invention.

A capacitor CD11 that functions as a decoupling capacitor may beconnected to the power supply line 60F. Specifically, in this case, oneend of the capacitor CD11 is connected to a node N53 provided in thepower supply line 60F, and the other end of the capacitor CD11 isconnected to the ground line 60N. Here, the node N53 is provided betweenthe switch SW4 and the first DC/DC converter 63 in the power supply line60F. In other words, the capacitor CD11 is connected to an output sideof the first DC/DC converter 63. Accordingly, power supply from thefirst DC/DC converter 63 to the switch SW4 (for example, the powerMOSFET) can be stabilized. As a result, power supply to the load 21 canbe stabilized. The capacitor CD11 is an example of a first smoothingcapacitor in the present invention.

As described above, the EN pin of the first DC/DC converter 63 is a pinfor setting the operation of the first DC/DC converter 63 on/off and isconnected to the PB3 pin of the MCU 50.

The MODE pin of the first DC/DC converter 63 is a pin for setting anoperation mode of the first DC/DC converter 63. The first DC/DCconverter 63 is, for example, a switching regulator, and can have apulse width modulation mode (hereinafter, also referred to as a PWMmode) and a pulse frequency modulation mode (hereinafter, also referredto as a PFM mode) as operation modes. In the present embodiment, byconnecting the MODE pin to the power supply line 60D, a high-levelvoltage is input to the MODE pin when the first DC/DC converter 63 canoperate, and the first DC/DC converter 63 is set to operate in the PWMmode.

As described above, the VIN pin of the second DC/DC converter 64 is thepower supply pin of the second DC/DC converter 64 on the positiveelectrode side, and is connected to the power supply line 60D. Further,the VIN pin of the second DC/DC converter 64 is also connected to the SWpin (the switch pin) of the second DC/DC converter 64 via a coil CL2.The GND pin of the second DC/DC converter 64 is a ground pin of thesecond DC/DC converter 64 and is connected to the ground line 60N.

The VOUT pin of the second DC/DC converter 64 is a pin that outputs thesecond high-voltage system voltage generated by the second DC/DCconverter 64, and is connected to the VCC_C pin of the display driver 65via a power supply line 60G. Accordingly, the second DC/DC converter 64can supply the second high-voltage system voltage to the display driver65.

A variable resistor VR5 is connected to the power supply line 60G.Specifically, one end of the variable resistor VR5 is connected to anode N61 provided in the power supply line 60G, and the other end of thevariable resistor VR5 is connected to the ground line 60N. In otherwords, the variable resistor VR5 is connected between a connectorportion connected to the VCC_C pin of the display driver 65 and thesecond DC/DC converter 64 in the power supply line 60G.

Therefore, even when static electricity is generated in the display 16by contact of the display 16 exposed to an outside of the aerosolinhaler 1 with any object (for example, a hand of the user) and thestatic electricity flows back to a second DC/DC converter 64 side viathe OLED panel 46 and the display driver 65, the static electricity canbe released to the ground line 60N via the variable resistor VR5, andthe second DC/DC converter 64 and the like can be protected from thestatic electricity. Further, even when the variable resistor VR5 fails,the second DC/DC converter 64 can serve as a barrier against noise (inthis case, the static electricity generated in the display 16) foranother element (for example, the LDO regulator 62) on the power supply12 side with respect to the variable resistor VR5, and can protectanother element.

From the same viewpoint, a variable resistor VR6 is also connected tothe power supply line 60E. Specifically, one end of the variableresistor VR6 is connected to a node N43 provided in the power supplyline 60E, and the other end of the variable resistor VR6 is connected tothe ground line 60N. Here, the node N43 is provided between the LDOregulator 62 and the switch SW3 in the power supply line 60E. Therefore,even when static electricity is generated in the display 16 by contactof the display 16 exposed to the outside of the aerosol inhaler 1 withany object and the static electricity flows back to an LDO regulator 62side via the OLED panel 46 and the display driver 65, the staticelectricity can be released to the ground line 60N via the variableresistor VR6, and the LDO regulator 62 can be protected from the staticelectricity.

A capacitor CD12 that functions as a decoupling capacitor is connectedto the power supply line 60G. Specifically, one end of the capacitorCD12 is connected to a node N62 provided in the power supply line 60G,and the other end of the capacitor CD12 is connected to the ground line60N. Here, the node N62 is provided on the second DC/DC converter 64side with respect to the node N61 in the power supply line 60G.Accordingly, a stable second high-voltage system voltage can be suppliedto the display driver 65, and even when static electricity is generatedin the display 16, the variable resistor VR5 can protect the capacitorCD12 from the static electricity. That is, in the power supply line 60G,by providing the node N62 on a second DC/DC converter side with respectto the node N61, it is possible to achieve both protection of thedisplay driver 65 from an overvoltage and a stable operation of thedisplay driver 65.

The EN pin of the second DC/DC converter 64 is a pin for setting theoperation of the second DC/DC converter 64 on/off and is connected tothe PC12 pin of the MCU 50 as described above.

As described above, the VDD pin of the display driver 65 is the powersupply pin of the display driver 65 on the positive electrode side andis connected to the power supply line 60E. Further, the VSS pin of thedisplay driver 65 is a power supply pin of the display driver 65 on anegative electrode side and is connected to the ground line 60N.Accordingly, the low-voltage system voltage output from the LDOregulator 62 is supplied to the display driver 65 via the power supplyline 60E. The low-voltage system voltage supplied to the display driver65 is used as a power supply for operating the display driver 65.

The VCC_C pin of the display driver 65 is a pin that receives the secondhigh-voltage system voltage, and is connected to the VOUT pin of thesecond DC/DC converter 64 via the power supply line 60G as describedabove. When receiving the second high-voltage system voltage by theVCC_C pin, the display driver 65 supplies the received secondhigh-voltage system voltage to the OLED panel 46 via a power supply line60H. Accordingly, the display driver 65 can cause the OLED panel 46 tooperate. The display driver 65 and the OLED panel 46 may also beconnected by another line (not shown). Further, the OLED panel 46 is anexample of a load in the present invention.

The SCL pin of the display driver 65 is a pin that receives a signal onan SCL side in I2C communication between the MCU 50 and the displaydriver 65, and is connected to the PB8 pin of the MCU 50 as describedabove. Further, the SDA pin of the display driver 65 is a pin thatreceives a signal on an SDA side in the I2C communication between theMCU 50 and the display driver 65, and is connected to the PB9 pin of theMCU 50 as described above.

The IXS pin of the display driver 65 is a pin for setting which of theI2C communication and serial peripheral interface (SPI) communication isused to perform communication between the display driver 65 and anotherIC (the MCU 50 in the present embodiment). In the present embodiment, byconnecting the IXS pin to the power supply line 60E, a high-levelvoltage is input to the IXS pin, and the communication between thedisplay driver 65 and the MCU 50 is set to be performed by the I2Ccommunication. The communication between the display driver 65 and theMCU 50 may be set to be performed by the SPI communication by inputtinga low-level voltage to the IXS pin.

(MCU)

Next, a configuration of the MCU 50 will be described with reference toFIG. 5.

As shown in FIG. 5, the MCU 50 includes an aerosol generation requestdetection unit 51, a temperature detection unit 52, a power control unit53, and a notification control unit 54 as functional blocks implementedby the processor executing a program stored in a ROM (not shown).

The aerosol generation request detection unit 51 detects an aerosolgeneration request based on an output result of the intake sensor 15.The intake sensor 15 is configured to output a value of a change in apressure (an internal pressure) in the power supply unit 10 caused bysuction of the user through the suction port 32. The intake sensor 15is, for example, a pressure sensor that outputs an output value (forexample, a voltage value or a current value) corresponding to aninternal pressure that changes according to a flow rate of air suckedfrom an intake port (not shown) toward the suction port 32 (that is, apuff operation of the user). The intake sensor 15 may be configured witha condenser microphone or the like. The intake sensor 15 may output ananalog value or may output a digital value converted from the analogvalue. Further, the intake sensor 15 may transmit an output to theaerosol generation request detection unit 51 by using the I2Ccommunication, the SPI communication, or the like described above.

The temperature detection unit 52 detects a temperature of the powersupply 12 based on an input from the thermistor circuit C2.Specifically, the temperature detection unit 52 applies a voltage to thethermistor circuit C2 by turning on the switch SW2, and detects atemperature of the thermistor TH, that is, the temperature of the powersupply 12 based on a voltage value input from the thermistor circuit C2to the MCU 50 (for example, the PC1 pin) at that time. Further, forexample, an electric resistance value of the load 21 may be configuredto be detectable, and the temperature detection unit 52 may detect atemperature of the load 21.

The power control unit 53 controls a supply of power to the electroniccomponents of the aerosol inhaler 1. For example, when the aerosolgeneration request detection unit 51 detects an aerosol generationrequest, the power control unit 53 causes the first DC/DC converter 63to operate and controls switching of the switch SW4 to supply power tothe load 21 via the positive electrode side discharging terminal 41 a.Accordingly, the MCU 50 can cause the load 21 to be heated (to function)and cause an aerosol to be generated. A specific example of powersupplied to the load 21 will be described later with reference to FIG.6.

The power control unit 53 supplies the standard system voltage to thevibrator 47 via the positive electrode side terminal 47 a by turning onthe switch SW3 at a predetermined timing. Accordingly, the MCU 50 cansupply the power of the standard system voltage to the vibrator 47 tocause the vibrator 47 to vibrate (function).

The power control unit 53 supplies the second high-voltage systemvoltage to the OLED panel 46 via the display driver 65 by causing thesecond DC/DC converter 64 to operate at a predetermined timing.Accordingly, the MCU 50 can supply power of the second high-voltagesystem voltage to the OLED panel 46 to cause the OLED panel 46 tooperate (function).

Incidentally, when a power supply to the load 21 and a power supply tothe OLED panel 46 are performed at the same time, discharging from thepower supply 12 at that time may become a large current. Then,discharging the large current imposes a heavy burden on the power supply12, and may lead to deterioration of the power supply 12. Therefore, itis desirable that the MCU 50 stops an operation (that is, a function) ofthe OLED panel 46 while supplying power to the load 21, that is, whilecausing the first DC/DC converter 63 and the switch SW4 to operate.

Specifically, when an input to the EN pin of the first DC/DC converter63 is at a high level, the MCU 50 sets an input to the EN pin of thesecond DC/DC converter 64 to a low level. Accordingly, when the firstDC/DC converter 63 and the switch SW4 are operated, the operation of thesecond DC/DC converter 64 is stopped, so that the power supply to theOLED panel 46 can be stopped and the operation (that is, the function)of the OLED panel 46 can be stopped.

In this way, by preventing the power supply to the load 21 and the powersupply to the OLED panel 46 from being performed at the same time, it ispossible to prevent the discharging of the large current from the powersupply 12 and to prevent the deterioration of the power supply 12 due tothe discharging of the large current.

The power supply to the OLED panel 46 is stopped while supplying powerto the load 21, that is, while causing the first DC/DC converter 63 andthe switch SW4 to operate, so that it is possible to prevent powersupplied to the first DC/DC converter 63 from becoming unstable (forexample, becoming insufficient). Accordingly, power supplied to the load21 can be stabilized. Therefore, it is possible to prevent a decrease inthe flavor of the aerosol inhaler 1 because of a variation in an amountof an aerosol generated by the load 21 due to a supply of unstable powerto the load 21.

When the aerosol generation request detection unit 51 detects theaerosol generation request, the power control unit 53 further turns onthe switch SW1 to put the LED circuit C1 in a conductive state, andcauses the LED 70 to emit light (function). In this case, a voltageobtained by lowering the standard system voltage from the charging IC 55by the resistor R8 is supplied to the connector 70 a. That is, byturning on the switch SW1, the power control unit 53 can supply power ofthe voltage obtained by lowering the standard system voltage by theresistor R8 to the LED 70 via the connector 70 a.

For example, the power control unit 53 performs control such that thepower supplied to the LED 70 is smaller than power supplied to otherelectronic components such as the load 21, the OLED panel 46, and thevibrator 47. That is, the power control unit 53 performs control suchthat the power supplied to the connector 70 a is smaller than the powersupplied to the positive electrode side discharging terminal 41 a, thepositive electrode side terminal 47 a, and the like. Accordingly, it ispossible to supply appropriate power to the LED 70 with a simpleconfiguration, and to implement high functionality of the aerosolinhaler 1 while preventing an increase in a manufacturing cost of theaerosol inhaler 1 (for example, the power supply unit 10).

The notification control unit 54 controls the notification unit 45 tonotify various pieces of information. For example, the notificationcontrol unit 54 controls the notification unit 45 to notify areplacement timing of the second cartridge 30 in response to detectionof the replacement timing of the second cartridge 30. The notificationcontrol unit 54 detects and notifies the replacement timing of thesecond cartridge 30 based on a cumulative number of times of the puffoperation or a cumulative energization time to the load 21 stored in thememory 19. The notification control unit 54 may notify not only thereplacement timing of the second cartridge 30, but also a replacementtiming of the first cartridge 20, a replacement timing of the powersupply 12, a charging timing of the power supply 12, and the like.

In a state where one unused second cartridge 30 is set, when the puffoperation is performed a predetermined number of times, or when thecumulative energization time to the load 21 by the puff operationreaches a predetermined value (for example, 120 seconds), thenotification control unit 54 may determine that the second cartridge 30has been used (that is, the remaining amount is zero or empty), and maynotify the replacement timing of the second cartridge 30.

When it is determined that all of the second cartridges 30 included inthe one set have been used, the notification control unit 54 maydetermine that one first cartridge 20 included in the one set has beenused (that is, the remaining amount is zero or empty), and may notifythe replacement timing of the first cartridge 20. In addition to orinstead of these, the notification control unit 54 may also notify aremaining amount of the first cartridge 20, a remaining amount of thesecond cartridge 30, a remaining capacity of the power supply 12, andthe like.

(Power Supplied to Load 21)

Next, a specific example of power supplied to the load 21 will bedescribed. The power supply unit 10 can increase the power supplied tothe load 21 by supplying a voltage boosted by the first DC/DC converter63 to the load 21. Accordingly, the amount of the aerosol generated bythe load 21 can be increased, and the flavor of the aerosol inhaler 1can be improved.

However, on the other hand, if excessive power is supplied to the load21, the user convenience may be reduced or the flavor may be reduced.Specifically, for example, an amount of the aerosol source 22 that canbe stored in the first cartridge 20 (the reservoir 23) is limited.Therefore, if the excessive power is supplied to the load 21 toexcessively increase a generation amount of the aerosol, the aerosolsource 22 is exhausted early, and it is necessary to replenish theaerosol source 22, that is, to replace the first cartridge 20frequently, which may reduce the user convenience.

An amount of the aerosol source 22 that can be supplied from thereservoir 23 to the load 21 per unit time by the wick 24 is alsolimited. Therefore, if the power supplied to the load 21 is excessivewith respect to the amount of the aerosol source 22 supplied to the load21, the aerosol is rapidly generated (for example, unnatural to theuser), which may lead to a decrease in the flavor.

Therefore, the power supply unit 10 supplies appropriate electric energyto the load 21, so that the amount of the aerosol generated by the load21 is appropriate, and the flavor of the aerosol inhaler 1 is improvedwhile preventing a decrease in the user convenience. Specifically, asshown in FIG. 4, in the power supply unit 10, the switch SW4 connectedbetween the first DC/DC converter 63 and the load 21 is provided, andthe switching of the switch SW4 prevents the supply of excessive powerto the load 21 and makes the amount of the aerosol generated by the load21 appropriate.

Hereinafter, details of the power supplied to the load 21 will bedescribed with reference to FIG. 6. FIG. 6 shows main parts forsupplying power to the load 21 in the electric circuit of the powersupply unit 10 shown in FIG. 4, and parts other than the main parts areomitted as appropriate.

As shown in FIG. 6, the first DC/DC converter 63 includes a logiccircuit 631, a PWM control circuit 632, a gate driver 633, a firstinternal switch SW634, and a second internal switch SW635.

The logic circuit 631 is a circuit that performs various calculationsrequired for the first DC/DC converter 63 to operate. The logic circuit631 is connected to the EN pin and the VIN pin of the first DC/DCconverter 63, and operates using power supplied via the VIN pin when anoperation command (that is, a high-level voltage signal) from the MCU 50is input to the EN pin. When the logic circuit 631 operates, the firstDC/DC converter 63 operates. The logic circuit 631 also supplies thepower supplied via the VIN pin to the PWM control circuit 632.Accordingly, the PWM control circuit 632 can operate using powersupplied from the logic circuit 631.

The logic circuit 631 is connected to the MODE pin of the first DC/DCconverter 63 and the PWM control circuit 632, and outputs operation modeinformation corresponding to a voltage input to the MODE pin to the PWMcontrol circuit 632. Here, the operation mode information is informationfor specifying the operation mode of the first DC/DC converter 63. Forexample, when the voltage input to the MODE pin is at a high level, thelogic circuit 631 outputs the operation mode information for specifyingthe PWM mode. On the other hand, when the voltage input to the MODE pinis at a low level, the logic circuit 631 outputs the operation modeinformation for specifying the PFM mode.

However, as described above, in the present embodiment, the MODE pin ofthe first DC/DC converter 63 is connected to the power supply line 60D.Therefore, the voltage input to the MODE pin when the first DC/DCconverter 63 can operate is always at a high level. Therefore, theoperation mode information output from the logic circuit 631 when thefirst DC/DC converter 63 can operate also always specifies the PWM mode.Accordingly, an operation mode when the first DC/DC converter 63operates can be fixed to the PWM mode.

Accordingly, by fixing the operation mode of the first DC/DC converter63 to the PWM mode, it is possible to prevent a fluctuation in an outputof the first DC/DC converter 63 caused by a transition of the operationmode of the first DC/DC converter 63 between the PWM mode and the PFMmode, and it is possible to stabilize the output of the first DC/DCconverter 63. Accordingly, the power supplied to the load 21 can bestabilized, and a decrease in the flavor of the aerosol inhaler 1 can beprevented.

When generating the aerosol, the load 21 requires a relatively largecurrent (for example, about 1.5 [A]). When such a relatively largecurrent is to be output from the first DC/DC converter 63, generally,efficiency of the first DC/DC converter 63 is higher when the firstDC/DC converter 63 is operated in the PWM mode than when the first DC/DCconverter 63 is operated in the PFM mode. That is, the PWM mode is moresuitable than the PFM mode to generate power to be supplied to a heavyload such as the load 21 that requires a relatively large current.Therefore, by operating the first DC/DC converter 63 in the PWM mode, itis possible to efficiently generate power required by the load 21 ascompared with a case where the first DC/DC converter 63 is operated inthe PFM mode. For example, it is possible to increase an amount of anaerosol generated per power for one charging of the power supply 12.

The PWM control circuit 632 is connected to the logic circuit 631 andthe gate driver 633, and controls the gate driver 633 according to anoperation mode specified by the operation mode information received fromthe logic circuit 631. For example, when the operation mode specified bythe operation mode information is the PWM mode, the PWM control circuit632 instructs the gate driver 633 to switch at least one of the firstinternal switch SW634 and the second internal switch SW635 by a PWMmethod. The PWM control circuit 632 may instruct the gate driver 633 toswitch only one of the first internal switch SW634 and the secondinternal switch SW635 by the PWM method and maintain the other of thefirst internal switch SW634 and the second internal switch SW635 in anON state. Further, the PWM control circuit 632 is also configured to beable to acquire a voltage value of an output voltage from downstream ofthe second internal switch SW635, that is, the VOUT pin of the firstDC/DC converter 63.

The gate driver 633 is connected to the VIN pin and the VOUT pin of thefirst DC/DC converter 63, and controls on/off of the first internalswitch SW634 and the second internal switch SW635 based on a comparisonbetween an input voltage (hereinafter, also referred to as Vin) to theVIN pin of the first DC/DC converter 63 and an output voltage(hereinafter, also referred to as Vout) from the VOUT pin of the firstDC/DC converter 63.

Here, the first internal switch SW634 and the second internal switchSW635 are, for example, switches implemented by MOSFETs or the likebuilt in the first DC/DC converter 63. The gate driver 633 can controlon/off of the first internal switch SW634 and the second internal switchSW635 by controlling gate voltages of the first internal switch SW634and the second internal switch SW635.

A boost rate (also referred to as a boost ratio) of the first DC/DCconverter 63, that is, Vout/Vin, changes according to a duty ratio ofswitching with respect to the first internal switch SW634. Then, thereis a relationship between the boost rate of the first DC/DC converter 63and the efficiency of the first DC/DC converter 63. Generally, as theboost rate of the first DC/DC converter 63 increases, a loss duringboosting increases, and the efficiency of the first DC/DC converter 63deteriorates. Therefore, it is desirable that the boost rate of thefirst DC/DC converter 63 be as low as possible within a range in which avoltage suitable for heating the load 21 can be obtained from the outputvoltage (that is, Vin) of the power supply 12.

Therefore, in the present embodiment, the first DC/DC converter 63outputs a voltage within a range of 4.0 [V] or higher and 4.5 [V] orlower (hereinafter, also referred to as 4.0 [V] to 4.5 [V]).Accordingly, when the first DC/DC converter 63 outputs a voltage in thevicinity of the fully charged voltage (4.2 [V]) of the power supply 12,a difference between Vin and Vout can be reduced. Therefore, the boostrate of the first DC/DC converter 63 can be lowered, the efficiency ofthe first DC/DC converter 63 can be improved, and for example, theamount of the aerosol generated per power for one charging of the powersupply 12 can be increased.

More specifically, the first DC/DC converter 63 may output a voltagewithin a range of 4.0 [V] or higher and 4.2 [V] or lower (hereinafter,also referred to as 4.0 [V] to 4.2 [V]). Alternatively, the first DC/DCconverter 63 may output a voltage equal to or lower than the fullycharged voltage (4.2 [V]) of the power supply 12. Accordingly, when thefirst DC/DC converter 63 outputs a voltage equal to or lower than thefully charged voltage of the power supply 12, depending on the remainingcapacity of the power supply 12, the boost rate of the first DC/DCconverter 63 can be set to “1” (that is, Vout=Vin) showing the highestefficiency, and the efficiency of the first DC/DC converter 63 can befurther improved.

The capacitor CD11 that functions as a decoupling capacitor (a smoothingcapacitor) is connected to the output side of the first DC/DC converter63. In the present embodiment, the capacitor CD11 is configured byconnecting a capacitor CD111 and a capacitor CD112 in parallel. Thecapacitor CD111 and the capacitor CD112 are, for example, capacitorshaving an electrostatic capacitance of about 50 [μF]. That is, anelectrostatic capacitance of the capacitor CD11 is about 100 [μF].

Accordingly, by connecting the capacitor CD11 having the relativelylarge electrostatic capacitance to the output side of the first DC/DCconverter 63, as shown by (A) in FIG. 6, it is possible to input astanding-wave voltage obtained by removing ripples from a voltage outputfrom the first DC/DC converter 63 to the switch SW4. Therefore, thepower supplied to the load 21 via the switch SW4 can be stabilized, anda decrease in the flavor of the aerosol inhaler 1 due to a supply ofunstable power to the load 21 can be prevented.

As described above, the switch SW4 is turned on in response to the oncommand of the MCU 50, and is turned off in response to the off commandof the MCU 50. The MCU 50 switches the switch SW4 at a duty ratio ofless than 1. Accordingly, a voltage output from the switch SW4 is notthe standing-wave voltage output by the first DC/DC converter 63, but isa pulsed voltage including an off period (a period of 0 [V]) as shown by(B) in FIG. 6. Therefore, the power supplied to the load 21 per unittime can be suppressed, and the amount of the aerosol generated by theload 21 can be made appropriate.

The duty ratio when switching the switch SW4 is, for example, single andfixed. Accordingly, a processing load on the MCU 50 at the time ofgenerating the aerosol can be reduced, the power supplied to the load 21can be stabilized to stabilize the amount of the aerosol generated bythe load 21, and the flavor of the aerosol inhaler 1 can be improved.

More specifically, the MCU 50 equalizes the duty ratio when switchingthe switch SW4 regardless of whether the power supply 12 is in the fullycharged state or in the end-of-discharging state. Accordingly,regardless of the remaining capacity of the power supply 12, the powersupplied to the load 21 can be stabilized, the amount of the aerosolgenerated by the load 21 can be stabilized, and the flavor of theaerosol inhaler 1 can be improved. The MCU 50 can determine theremaining capacity of the power supply 12, that is, whether the powersupply 12 is in the fully charged state or in the end-of-dischargingstate, based on the remaining capacity information received from thecharging IC 55.

As the switch SW4, it is desirable to adopt a switch having anon-resistance as low as possible, and specifically, it is desirable toadopt a switch having an on-resistance lower than those of the firstinternal switch SW634 and the second internal switch SW635. In thepresent embodiment, an on-resistance of the switch SW4 is about 5 [mΩ],an on-resistance of the first internal switch SW634 is about 10 [mΩ],and an on-resistance of the second internal switch SW635 is about 20[mΩ]. Accordingly, by reducing the on-resistance of the switch SW4, itis possible to prevent a voltage boosted by the first DC/DC converter 63from being excessively reduced by the switch SW4, that is, prevent thepower supplied to the load 21 from being excessively reduced byproviding the switch SW4. Therefore, appropriate electric energy can besupplied to the load 21, and the amount of the aerosol generated by theload 21 can be made appropriate.

The capacitor CD10 that functions as a decoupling capacitor is connectedto the output side of the switch SW4. Accordingly, a voltage obtained byremoving a surge (noise) from a voltage (that is, a pulsed voltage)output from the switch SW4 can be supplied to the load 21. Therefore,the power supplied to the load 21 via the switch SW4 can be stabilized,and the decrease in the flavor of the aerosol inhaler 1 due to thesupply of unstable power to the load 21 can be prevented.

It is desirable that the capacitor CD10 and the capacitor CD11 arecapacitors suitable for respective uses, and specifically, it isdesirable that an electrostatic capacitance of the capacitor CD10 andthe electrostatic capacitance of the capacitor CD11 are different fromeach other. Accordingly, it is possible to adopt capacitors havingappropriate electrostatic capacitances corresponding to respective usesas the capacitors CD10 and CD11.

More specifically, the electrostatic capacitance of the capacitor CD11is preferably larger than the electrostatic capacitance of the capacitorCD10. In the present embodiment, the electrostatic capacitance of thecapacitor CD10 is set to 1 [μF] or less with respect to the capacitorCD11 having an electrostatic capacitance of about 100 [μF]. Accordingly,according to the capacitor CD11 having a large electrostaticcapacitance, ripples can be cleanly removed from the voltage output fromthe first DC/DC converter 63. On the other hand, according to thecapacitor CD10 having a small electrostatic capacitance, it is possibleto supply a rectangular-wave voltage obtained by removing a surge fromthe voltage output from the switch SW4 to the load 21 without smoothingthe voltage output from the switch SW4 halfway. At the same time,mounting areas of boards of the capacitors CD10 and CD11 can be reduced.

(Circuit Board)

Next, a specific example of the circuit board 60 of the presentembodiment will be described with reference to FIGS. 2 and 7 to 10. Itshould be noted that FIGS. 7 to 10 disclose only main parts of thecircuit configuration of the circuit board 60. As shown in FIG. 2, thecircuit board 60 includes a first surface 71 and a second surface 72positioned on a back side of the first surface 71. The first surface 71and the second surface 72 are surfaces substantially perpendicular tothe left-right direction. Then, the first surface 71 constitutes a rightsurface of the circuit board 60, and the second surface 72 constitutes aleft surface of the circuit board 60. Then, the second surface 72 facesthe power supply 12, and/or the second surface 72 is disposed closer tothe power supply 12 than the first surface 71. In the presentembodiment, the second surface 72 faces the power supply 12.

A plurality of elements are mounted on the first surface 71 thatconstitutes the right surface of the circuit board 60 and the secondsurface 72 that constitutes the left surface of the circuit board 60.

As shown in FIGS. 7 to 10, the circuit board 60 further includes aground layer 73 and a power supply layer 74, and the ground layer 73 andthe power supply layer 74 are provided between the first surface 71 andthe second surface 72. That is, in the present embodiment, the circuitboard 60 is a four-layer multilayer board in which the first surface 71,the ground layer 73, the power supply layer 74, and the second surface72 are stacked. In the present embodiment, the circuit board 60 isconfigured by stacking the first surface 71, the ground layer 73, thepower supply layer 74, and the second surface 72 in this order from aright side. Instead of the present embodiment, the circuit board 60 maybe a multilayer board having five or more layers by having at least oneof the first surface 71, the ground layer 73, the power supply layer 74,and the second surface 72 having multiple layers. Further, the firstsurface 71, the ground layer 73, the power supply layer 74, and thesecond surface 72 may be divided into two or more groups, and may bestacked only in the same group. It should be noted that, in this case,the circuit board 60 is physically divided into two or more, but anorder in which the first surface 71, the ground layer 73, the powersupply layer 74, and the second surface 72 are arranged in theleft-right direction is not changed.

The circuit board 60 has a substantially L shape as a whole when viewedfrom the left-right direction substantially perpendicular to the firstsurface 71 and the second surface 72 on which the plurality of elementsare mounted. Specifically, when viewed from the left-right direction,the circuit board 60 includes a coupling portion 600 having asubstantially quadrangular shape, a first portion 601 that extendsforward from a front end surface of the coupling portion 600, and asecond portion 602 that extends upward from an upper end surface of thecoupling portion 600. The first surface 71, the ground layer 73, thepower supply layer 74, and the second surface 72 have substantially thesame shape, and are substantially L-shaped when viewed from theleft-right direction. Specifically, when viewed from the left-rightdirection, the first surface 71 includes a coupling portion 710 having asubstantially quadrangular shape, a first portion 711 that extendsforward from a front end portion of the coupling portion 710, and asecond portion 712 that extends upward from an upper end surface of thecoupling portion 710. When viewed from the left-right direction, thesecond surface 72 includes a coupling portion 720 having a substantiallyquadrangular shape, a first portion 721 that extends forward from afront end portion of the coupling portion 720, and a second portion 722that extends upward from an upper end surface of the coupling portion720. When viewed from the left-right direction, the ground layer 73includes a coupling portion 730 having a substantially quadrangularshape, a first portion 731 that extends forward from a front end portionof the coupling portion 730, and a second portion 732 that extendsupward from an upper end surface of the coupling portion 730. Whenviewed from the left-right direction, the power supply layer 74 includesa coupling portion 740 having a substantially quadrangular shape, afirst portion 741 that extends forward from a front end portion of thecoupling portion 740, and a second portion 742 that extends upward froman upper end surface of the coupling portion 740. The coupling portion600 of the circuit board 60 is formed by the coupling portions 710, 730,740, and 720 respectively of the first surface 71, the ground layer 73,the power supply layer 74, and the second surface 72. The first portion601 of the circuit board 60 is formed by the first portions 711, 731,741, and 721 respectively of the first surface 71, the ground layer 73,the power supply layer 74, and the second surface 72. The second portion602 is formed by the second portions 712, 732, 742, and 722 respectivelyof the first surface 71, the ground layer 73, the power supply layer 74,and the second surface 72.

As shown in FIG. 7, elements such as the display driver 65, the secondDC/DC converter 64, the MCU 50, the charging IC 55, the LDO regulator62, the protection IC 61, the first DC/DC converter 63, and a powersupply connector 81 are mounted on the first surface 71 of the circuitboard 60. Further, an intake sensor connection portion 82, a switchconnection portion 83, and a vibrator connection portion 84 are formedon the first surface 71 of the circuit board 60.

The display driver 65 is mounted above a center of the second portion712 in the upper-lower direction. The OLED panel 46 is disposed abovethe circuit board 60, and the display driver 65 and the OLED panel 46are connected by the power supply line 60H.

The second DC/DC converter 64 is mounted slightly above the center ofthe second portion 712 in the upper-lower direction and in front of andbelow the display driver 65.

The MCU 50 is mounted at a position that straddles a lower end portionof the second portion 712 and an upper end portion of the couplingportion 710.

The charging IC 55 is mounted on a rear end portion of the first portion711.

Accordingly, the charging IC 55 is mounted on the first surface 71positioned on the back side of the second surface 72 that faces thepower supply 12 and/or is disposed close to the power supply 12.Accordingly, the power supply 12 can be prevented from being heated byheat generated by the charging IC 55 during charging of the power supply12.

The LDO regulator 62 is mounted between the MCU 50 and the charging IC55 in the front-rear direction at a substantially central portion of thecoupling portion 710 in the upper-lower direction.

Accordingly, the LDO regulator 62 is mounted on the first surface 71positioned on the back side of the second surface 72 that faces thepower supply 12 and/or is disposed close to the power supply 12.Accordingly, the power supply 12 can be prevented from being heated byheat generated by the LDO regulator 62 during the charging of the powersupply 12.

The protection IC 61 is mounted at a position that is below the chargingIC 55 and the LDO regulator 62 and straddles the coupling portion 710and the first portion 711.

The first DC/DC converter 63 is mounted on a front upper end portion ofthe first portion 711.

Accordingly, the first DC/DC converter 63 is mounted on the firstsurface 71 positioned on the back side of the second surface 72 thatfaces the power supply 12 and/or is disposed close to the power supply12. Therefore, the power supply 12 can be prevented from being heated byheat generated when the first DC/DC converter 63 functions.

The power supply connector 81 is a connector for electrically connectingthe circuit board 60 to the power supply 12, and is mounted below thefirst DC/DC converter 63 and on a lower end portion of the first portion711. A power line or the like connected to the power supply 12 isconnected to the power supply connector 81. Further, the power supplyconnector 81 and the charging IC 55 are mounted on one of left and rightsides (a right side in the present embodiment, that is, a front side ofthe aerosol inhaler 1) when viewed from a position where the chargingterminal 43 is mounted on the circuit board 60. Accordingly, the powersupply connector 81, which is an element for charging the power supply12, and the charging IC 55 can be integrated and mounted on the circuitboard 60, and the circuit board 60 can be miniaturized and chargingefficiency can be improved.

The intake sensor connection portion 82 is formed at a substantiallycentral portion in the upper-lower direction of a front end portion ofthe second portion 712. A power line connected to the intake sensor 15is soldered to the intake sensor connection portion 82.

The switch connection portion 83 is formed at a substantially centralportion in the upper-lower direction of a rear end portion of the secondportion 712. A power line connected to the operation unit 18 is solderedto the switch connection portion 83.

The vibrator connection portion 84 is formed at a rear lower end portionof the coupling portion 710. A power line connected to the positiveelectrode side terminal 47 a and the negative electrode side terminal 47b of the vibrator 47 is soldered to the vibrator connection portion 84.

Therefore, the first DC/DC converter 63 and the second DC/DC converter64 are mounted on the circuit board 60 such that the first DC/DCconverter 63 and the second DC/DC converter 64 are separated from eachother. More specifically, the first DC/DC converter 63 is mounted on thefirst portion 601 of the circuit board 60, and the second DC/DCconverter 64 is mounted on the second portion 602 of the circuit board60. Further, the first DC/DC converter 63 is mounted on the firstportion 601 of the circuit board 60, the second DC/DC converter 64 ismounted on the second portion 602 of the circuit board 60, and the MCU50 is mounted at the position that straddles the lower end portion ofthe second portion 712 and the upper end portion of the coupling portion710 of the circuit board 60. Accordingly, a distance between the firstDC/DC converter 63 and the second DC/DC converter 64 is longer than adistance between the first DC/DC converter 63 and the MCU 50 and longerthan a distance between the second DC/DC converter 64 and the MCU 50.The term “distance” here refers to a shortest distance by which twoobjects are connected with a straight line (that is, a straight-linedistance). The same applies to the following description.

Accordingly, since the first DC/DC converter 63 and the second DC/DCconverter 64 are mounted on the circuit board 60 such that the firstDC/DC converter 63 and the second DC/DC converter 64 are separated fromeach other, the first DC/DC converter 63 and the second DC/DC converter64 can reduce an influence of heat or switching noise generated by oneof the DC/DC converters on the other DC/DC converter.

Since both the first DC/DC converter 63 and the second DC/DC converter64 are mounted on the first surface 71 of the circuit board 60, thefirst DC/DC converter 63 and the second DC/DC converter 64 are arrangedon the same surface. The second surface 72 on which the first DC/DCconverter 63 and the second DC/DC converter 64 are not mounted can beless likely to be influenced by the heat or the switching noisegenerated by the DC/DC converter.

As shown in FIG. 10, the LED 70, the discharging terminal 41, a powermodule 85, the charging terminal 43, and the thermistor TH are mountedon the second surface 72 of the circuit board 60.

The LED 70 is mounted on a substantially central portion in theupper-lower direction of a rear end portion of the second portion 722.

The discharging terminal 41 is mounted so as to protrude upward from anupper end portion of the first portion 721. The discharging terminal 41is a pin or the like with a built-in spring, is connected to the load 21of the first cartridge 20, and power of the power supply 12 is suppliedfrom the discharging terminal 41 to the load 21.

The power module 85 is mounted on the first portion 721 below thedischarging terminal 41. The power module 85 includes the switch SW4,the capacitor CD10, and the variable resistor VR4. Further, although thepower module 85 includes the switch SW4, the power module 85 may includeno capacitor CD10 and no variable resistor VR4. In this case, thecapacitor CD10 and the variable resistor VR4 may be provided between thedischarging terminal 41 and the power module 85.

The charging terminal 43 is mounted so as to protrude downward from alower end portion of the second surface 72 at a position that straddlesthe coupling portion 720 and the first portion 721 in the front-reardirection.

Further, when viewed from the left-right direction, on the first surface71 positioned on the back side of the second surface 72, at least a partof the protection IC 61 is mounted on a region overlapping the chargingterminal 43 mounted on the second surface 72 (see FIG. 7).

Accordingly, the elements can be mounted on the circuit board 60 at ahigh density, and the circuit board 60 can be further miniaturized.

The thermistor TH is mounted on a region on a rear side and a lower sideof the coupling portion 720. Therefore, the thermistor TH is mounted ona rear lower end portion of the entire second surface 72.

Since the thermistor TH is mounted on the second surface 72 that facesthe power supply 12 and/or is disposed closer to the power supply 12than the first surface 71, the thermistor TH can be disposed so as toface the power supply 12 and/or disposed close to the power supply 12.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

The thermistor TH and the resistor R9 form the thermistor circuit C2 onthe second surface 72. The resistor R9 is mounted on the second surface72 in front of the thermistor TH.

The thermistor TH is disposed away from the resistor R9, and at leastone of the plurality of elements is mounted at a position where astraight-line distance starting from the resistor R9 is shorter than astraight-line distance between the resistor R9 and the thermistor TH. Inthe present embodiment, the switch SW2 is mounted at the position wherethe straight-line distance starting from the resistor R9 is shorter thanthe straight-line distance between the resistor R9 and the thermistorTH.

Accordingly, since the thermistor TH is mounted on the second surface 72away from the resistor R9, the thermistor TH is less likely to beinfluenced by heat generated by the resistor R9. Accordingly, thethermistor TH can detect a temperature of the power supply 12 moreaccurately.

Since the thermistor TH is mounted on the second surface 72 differentfrom the first surface 71 on which the MCU 50 is mounted, the thermistorTH is less likely to be influenced by heat generated by the MCU 50.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

Since the first DC/DC converter 63 is mounted on the first surface 71different from the second surface 72 on which the thermistor TH ismounted, the thermistor TH is less likely to be influenced by heatgenerated by the first DC/DC converter 63. Accordingly, the thermistorTH can detect a temperature of the power supply 12 more accurately.

Since the LDO regulator 62 is mounted on the first surface 71 differentfrom the second surface 72 on which the thermistor TH is mounted, thethermistor TH is less likely to be influenced by heat generated by theLDO regulator 62. Accordingly, the thermistor TH can detect atemperature of the power supply 12 more accurately.

Since the charging IC 55 is mounted on the first surface 71 differentfrom the second surface 72 on which the thermistor TH is mounted, thethermistor TH is less likely to be influenced by heat generated by thecharging IC 55. Accordingly, the thermistor TH can detect a temperatureof the power supply 12 more accurately.

Both the first DC/DC converter 63 and the discharging terminal 41connected to the load 21 that functions by consuming power output by thefirst DC/DC converter 63 are mounted on the first portion 601 of thecircuit board 60. Both the second DC/DC converter 64 and the displaydriver 65 connected to the OLED panel 46 that functions by consumingpower output by the second DC/DC converter 64 are mounted on the secondportion 602 of the circuit board 60.

The discharging terminal 41 is not necessarily mounted on the firstportion 601 of the circuit board 60. For example, the dischargingterminal 41 may be mounted on a portion of the circuit board 60 otherthan the first portion 601 and connected to an element mounted on thefirst portion 601. Further, the display driver 65 is not necessarilymounted on the second portion 602 of the circuit board 60. For example,the display driver 65 may be mounted on a portion of the circuit board60 other than the second portion 602, and connected to an elementmounted on the second portion 602.

Accordingly, since the discharging terminal 41 is mounted on orconnected to the first portion 601 of the circuit board 60 and thedisplay driver 65 is mounted on or connected to the second portion 602of the circuit board 60, the discharging terminal 41 can be disposedclose to the first DC/DC converter 63 and the display driver 65 can bedisposed close to the second DC/DC converter 64. Therefore, it ispossible to shorten a path for supplying power boosted by the firstDC/DC converter 63 to the load 21, and it is possible to shorten a pathfor supplying power boosted by the second DC/DC converter 64 to the OLEDpanel 46. Accordingly, it is possible to reduce a loss of the powerboosted by the first DC/DC converter 63 and the second DC/DC converter64. Then, it is possible to prevent an influence of the loss of thepower boosted by the first DC/DC converter 63 and the second DC/DCconverter 64 on other elements, and it is possible to prevent a decreasein an amount of an aerosol that can be generated by one charging.

The first DC/DC converter 63 is mounted on the first surface 71, and thepower module 85 is mounted on the second surface 72. Accordingly, sincethe first DC/DC converter 63 and the power module 85 are mounted ondifferent surfaces of the circuit board 60, it is possible to preventconcentration of the heat generated by the first DC/DC converter 63 andheat generated by the power module 85 during power supply to the load21.

Since the power module 85 and the discharging terminal 41 are bothmounted on the first portion 721 of the second surface 72, the powermodule 85 and the discharging terminal 41 are mounted close to eachother. Accordingly, a length of a portion of the power supply line 60Fthat electrically connects the power module 85 and the dischargingterminal 41 can be shortened, and a power loss between the power module85 and the discharging terminal 41 can be reduced. Further, a pulsedcurrent flows through the portion of the power supply line 60F thatelectrically connects the power module 85 and the discharging terminal41. Therefore, by shortening the length of the portion of the powersupply line 60F that electrically connects the power module 85 and thedischarging terminal 41, it is possible to prevent an influence of thepulsed current on other elements.

No element is mounted in a region overlapping the thermistor TH mountedon the second surface 72 on the first surface 71 positioned on the backside of the second surface 72 when viewed from the left-right direction.

Therefore, the thermistor TH is less likely to be influenced by heatgenerated by the elements mounted on the first surface 71 positioned onthe back side of the second surface 72. Accordingly, the thermistor THcan detect a temperature of the power supply 12 more accurately.

The second surface 72 includes high-density regions 72A where a largenumber of elements are mounted and a mounting density of the mountedelements is high, and low-density regions 72B where a mounting densityof mounted elements is lower than those of the high-density regions 72A.In the present embodiment, the first portion 721, a region on an upperside of the coupling portion 720, and a region in the vicinity of acenter in the upper-lower direction of the coupling portion 720 betweenthe coupling portion 720 and the first portion 721 are the high-densityregions 72A. In the present embodiment, the thermistor TH is mounted inthe region on the rear side and the lower side of the coupling portion720 that is one of the low-density regions 72B where the mountingdensity of the mounted elements is lower than those of the high-densityregions 72A. In the present embodiment, in addition to the region on therear side and the lower side of the coupling portion 720, a region on alower side of the second portion 722, and a region on the rear side andan upper side of the second portion 722 are the low-density regions 72B.

Therefore, since the thermistor TH is mounted in the region where themounting density of the mounted elements is low, the thermistor TH isless likely to be influenced by heat generated by other elements mountedon the circuit board 60. Accordingly, the thermistor TH can detect atemperature of the power supply 12 more accurately.

As shown in FIG. 8, the ground line 60N is formed on the ground layer 73of the circuit board 60. In the present embodiment, the ground line 60Nis a conductive thin film formed on the ground layer 73 of the circuitboard 60, and has a reference potential of the circuit board 60.

The ground line 60N is not formed in a region overlapping the thermistorTH mounted on the second surface 72 when viewed from the left-rightdirection. Therefore, the thermistor TH is less likely to be influencedby heat generated by the ground line 60N. Accordingly, the thermistor THcan detect a temperature of the power supply 12 more accurately.

The ground line 60N is not formed in a region at a rear lower end of theground layer 73 including the region overlapping the thermistor THmounted on the second surface 72 when viewed from the left-rightdirection. In other words, the ground line 60N has a shape obtained bycutting out the region at the rear lower end of the ground layer 73 whenviewed from the left-right direction. Therefore, when viewed from theleft-right direction, the ground line 60N is not formed in the regionoverlapping the thermistor TH, and is formed so as not to surround thethermistor TH. Therefore, the thermistor TH is further less likely to beinfluenced by the heat generated by the ground line 60N. Accordingly,the thermistor TH can detect a temperature of the power supply 12 moreaccurately.

As shown in FIG. 9, a power supply path 743 for supplying power to theelements mounted on the circuit board 60 is formed on the power supplylayer 74 of the circuit board 60. The power supply path 743 isconfigured with the power supply lines 60A, 60B, 60C, 60D, 60E, 60G, andthe like. The power supply path 743 is a circuit wiring of a conductorformed on the power supply layer 74 of the circuit board 60 by printingor the like.

The power supply path 743 is not formed in the region overlapping thethermistor TH mounted on the second surface 72 when viewed from theleft-right direction. Therefore, the thermistor TH is less likely to beinfluenced by heat generated by the power supply path 743. Accordingly,the thermistor TH can detect a temperature of the power supply 12 moreaccurately.

The power supply path 743 is not formed in a region at a rear lower endof the power supply layer 74 including the region overlapping thethermistor TH mounted on the second surface 72 when viewed from theleft-right direction. Further, the power supply path 743 is formed so asnot to surround the thermistor TH when viewed from the left-rightdirection. Therefore, the thermistor TH is further less likely to beinfluenced by the heat generated by the power supply path 743.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

Accordingly, neither the ground line 60N of the ground layer 73 nor thepower supply path 743 of the power supply layer 74 is formed in theregion overlapping the thermistor TH mounted on the second surface 72when viewed from the left-right direction. Therefore, the thermistor THis less likely to be influenced by heat generated by both the groundline 60N and the power supply path 743. Accordingly, the thermistor THcan detect a temperature of the power supply 12 more accurately.

Returning to FIG. 2, the internal holder 13 holds the circuit board 60on a right side of the partition wall 13 d and holds the power supply 12on a left side of the partition wall 13 d. Accordingly, since both thecircuit board 60 and the power supply 12 are held by the internal holder13, the thermistor TH can be maintained at a position suitable fordetecting a temperature of the power supply 12.

The internal holder 13 may hold only a part of the circuit board 60 onthe right side of the partition wall 13 d and hold only a part of thepower supply 12 on the left side of the partition wall 13 d. Morespecifically, the internal holder 13 may hold the circuit board 60 andthe power supply 12 such that the position of the power supply 12 thatfaces the thermistor TH is exposed from the internal holder 13 in aleft-right direction of the thermistor TH. In this way, since atemperature of the power supply 12 is transmitted to the thermistor THwithout passing through the partition wall 13 d, the thermistor TH candetect the temperature of the power supply 12 more accurately and at ahigh speed.

As described above, in the present embodiment, among the power supplyconnector 81, the MCU 50, the charging IC 55, and the charging terminal43, the power supply connector 81, the MCU 50, and the charging IC 55are mounted on the first surface 71 of the circuit board 60, and thecharging terminal 43 is mounted on the second surface 72 of the circuitboard 60. Accordingly, the charging terminal 43 and the elements forcharging the power supply 12 are dispersedly mounted on both the firstsurface 71 and the second surface 72 of the circuit board 60, so thatheat generated by the charging terminal 43 and the elements whencharging the power supply 12 can be dispersed. The present invention isnot limited to the example described in the present embodiment. When thecharging terminal 43 and the elements for charging the power supply 12are separately mounted on both the first surface 71 and the secondsurface 72, the heat generated by the charging terminal 43 and theelements when charging the power supply 12 can be dispersed. That is,for example, among the power supply connector 81, the MCU 50, thecharging IC 55, and the charging terminal 43, the MCU 50 and thecharging IC 55 may be mounted on the first surface 71, and the powersupply connector 81 and the charging terminal 43 may be mounted on thesecond surface 72.

As described above, according to the power supply unit 10 and theaerosol inhaler 1 including the power supply unit 10 of the presentembodiment, by supplying appropriate electric energy to the load 21, theamount of the aerosol generated by the load 21 can be made appropriate,and the flavor of the aerosol inhaler 1 can be improved while preventinga decrease in the user convenience.

The present invention is not limited to the above-described embodiment,and can be appropriately modified, improved, and the like.

For example, in the above-described embodiment, the first DC/DCconverter 63 and the second DC/DC converter 64 are both mounted on thefirst surface 71 of the circuit board 60, but the first DC/DC converter63 may be mounted on the first surface 71 of the circuit board 60, andthe second DC/DC converter 64 may be mounted on the second surface 72 ofthe circuit board 60. In this way, the first DC/DC converter 63 and thesecond DC/DC converter 64 can be arranged away from each other by beingmounted on different surfaces. Therefore, the first DC/DC converter 63and the second DC/DC converter 64 can reduce the influence of the heator the switching noise generated by one of the DC/DC converters on theother DC/DC converter.

In the above-described embodiment, the ground layer 73 has substantiallythe same shape as those of the first surface 71 and the second surface72 when viewed from the left-right direction, but the ground layer 73may have a shape in which a region at a rear lower end is cut out withrespect to the first surface 71 and the second surface 72. In this way,the thermistor TH is further less likely to be influenced by the heatgenerated by the ground line 60N. Accordingly, the thermistor TH candetect a temperature of the power supply 12 more accurately.

In the above-described embodiment, the power supply layer 74 hassubstantially the same shape as those of the first surface 71 and thesecond surface 72 when viewed from the left-right direction, but thepower supply layer 74 may have a shape in which a region at a rear lowerend is cut out with respect to the first surface 71 and the secondsurface 72. In this way, the thermistor TH is further less likely to beinfluenced by the heat generated by the power supply path 743.Accordingly, the thermistor TH can detect a temperature of the powersupply 12 more accurately.

For example, in the present embodiment, a temperature of the powersupply 12 is acquired by the thermistor TH, but the temperature of thepower supply 12 may be acquired by an optional temperature sensorwithout being limited to the thermistor TH.

For example, in the present embodiment, the circuit board 60 isconfigured with the coupling portion 600, the first portion 601, and thesecond portion 602, and the entire circuit board 60 has a substantiallyL shape, but a part of the circuit board 60 may be configured to have asubstantially L shape by the coupling portion 600, the first portion601, and the second portion 602.

In the above-described embodiment, the circuit board 60 and the powersupply 12 are arranged inside the power supply unit case 11 so as tooverlap each other in the left-right direction, but the circuit board 60and the power supply 12 may not overlap each other in the left-rightdirection, and may be offset and arranged inside the power supply unitcase 11. However, it should be noted that even in this case, the secondsurface 72 is disposed closer to the power supply than the first surface71.

At least the following matters are described in the present description.It should be noted that although corresponding components in the aboveembodiment are shown in parentheses, the present invention is notlimited thereto.

(1) A power supply unit (the power supply unit 10) for an aerosolgeneration device (the aerosol inhaler 1) including:

a connector (the discharging terminal 41) to which a heater (the load21) configured to heat an aerosol source (the aerosol source 22) isconnected;

a power supply (the power supply 12);

a boost converter (the first DC/DC converter 63) connected between thepower supply and the connector; and

a switch (the switch SW4) connected between the boost converter and theconnector.

According to (1), since the switch connected between the boost converterand the connector is provided, power supplied to the heater can be madeappropriate by opening and closing the switch, and an amount of anaerosol generated by the heater can be made appropriate.

(2) The power supply unit for the aerosol generation device according to(1), further including:

a controller (the MCU 50) configured to switch the switch at a dutyratio of less than 1.

According to (2), since the controller switches the switch at the dutyratio of less than 1, a voltage output from the switch is a pulsedvoltage including an off period. Therefore, power supplied to the heaterper unit time can be suppressed. Accordingly, it is possible to preventexcessive power from being supplied to the heater, to supply appropriateelectric energy to the heater, and to make the amount of the aerosolgenerated by the heater appropriate.

(3) The power supply unit for the aerosol generation device according to(2),

in which the duty ratio is single and fixed.

According to (3), a processing load on the controller at the time ofgenerating the aerosol can be reduced, the power supplied to the heatercan be stabilized, the amount of the aerosol generated by the heater canbe stabilized, and a flavor can be improved.

(4) The power supply unit for the aerosol generation device according to(2),

in which the controller is configured to acquire information on aremaining capacity of the power supply, and

in which the controller is configured to equalize the duty ratio wheninformation on the remaining capacity indicates a fully charged state ofthe power supply and the duty ratio when information on the remainingcapacity indicates an end-of-discharging state of the power supply.

According to (4), regardless of the remaining capacity of the powersupply, the power supplied to the heater can be stabilized, the amountof the aerosol generated by the heater can be stabilized, and the flavorcan be improved.

(5) The power supply unit for the aerosol generation device according toany one of (2) to (4), further including:

a load (the OLED panel 46) that is separate from the heater andfunctions by power supplied from the power supply,

in which the controller is configured to stop a function of the loadwhile causing the boost converter and the switch to operate.

According to (5), the controller is configured to stop the function ofthe load while causing the boost converter and the switch to operate.Therefore, it is possible to prevent a power supply to the heater and apower supply to the load from being performed at the same time, toprevent discharging of a large current from the power supply, and toprevent deterioration of the power supply due to the discharging of thelarge current. Further, the power supplied to the heater can bestabilized, the amount of the aerosol generated by the heater can bestabilized, and the flavor can be improved.

(6) The power supply unit for the aerosol generation device according toany one of (1) to (5),

in which the boost converter includes a pin (the MODE pin) configured tospecify an operation mode when the boost converter operates, and

in which a fixed value is input to the pin.

According to (6), it is possible to prevent a fluctuation in an outputof the boost converter caused by a transition of the operation mode ofthe boost converter, and to stabilize the output of the boost converter.

(7) The power supply unit for the aerosol generation device according toany one of (1) to (6),

in which the boost converter is configured to output 4.0 [V] to 4.5 [V].

According to (7), a boost rate of the boost converter can be reduced,efficiency of the boost converter can be improved, and, for example, anamount of an aerosol generated per power for one charging of the powersupply can be increased.

(8) The power supply unit for the aerosol generation device according to(7),

in which the boost converter is configured to output 4.0 [V] to 4.2 [V].

According to (8), depending on the remaining capacity of the powersupply, the boost rate of the boost converter can be set to “1” showingthe highest efficiency, and the efficiency of the boost converter can befurther improved.

(9) The power supply unit for the aerosol generation device according toany one of (1) to (6),

in which the boost converter is configured to output a voltage equal toor lower than a fully charged voltage of the power supply.

According to (9), depending on the remaining capacity of the powersupply, the boost rate of the boost converter can be set to “1” showingthe highest efficiency, and the efficiency of the boost converter can befurther improved.

(10) The power supply unit for the aerosol generation device accordingto any one of (1) to (9), further including:

a first smoothing capacitor (the capacitor CD11) connected to an outputside of the boost converter; and

a second smoothing capacitor (the capacitor CD10) connected to an outputside of the switch.

According to (10), the first smoothing capacitor can remove ripples froman output of the boost converter, and the second smoothing capacitor canremove a surge (noise) from an output of the switch.

(11) The power supply unit for the aerosol generation device accordingto (10),

in which a capacitance of the first smoothing capacitor is differentfrom a capacitance of the second smoothing capacitor.

According to (11), it is possible to adopt capacitors having appropriatecapacitances corresponding to respective uses as the first smoothingcapacitor and the second smoothing capacitor.

(12) The power supply unit for the aerosol generation device accordingto (10),

in which a capacitance of the first smoothing capacitor is larger than acapacitance of the second smoothing capacitor.

According to (12), while reducing mounting areas of boards of the firstsmoothing capacitor and the second smoothing capacitor, the firstsmoothing capacitor can appropriately remove the ripples from the outputof the boost converter, and the second smoothing capacitor canappropriately remove the surge (the noise) from the output of theswitch.

(13) The power supply unit for the aerosol generation device accordingto any one of (1) to (12),

in which an on-resistance of the switch is smaller than an on-resistanceof a switch (the first internal switch SW634, the second internal switchSW635) built in the boost converter.

According to (13), it is possible to prevent a voltage boosted by theboost converter from being excessively reduced by the switch, that is,prevent the power supplied to the heater from being excessively reducedby providing the switch, and it is possible to make the amount of theaerosol generated by the heater appropriate.

(14) The power supply unit for the aerosol generation device accordingto any one of (1) to (13), further including:

a circuit board including a first surface (the first surface 71) onwhich the boost converter is mounted, and a second surface (the secondsurface 72) that is a back surface of the first surface or that ispositioned on a back side of the first surface and on which the switchis mounted.

According to (14), since the boost converter is mounted on the firstsurface and the switch is mounted on the second surface, it is possibleto prevent concentration of heat generated by the boost converter andheat generated by the switch when supplying power to the heater.

(15) The power supply unit for the aerosol generation device accordingto (14),

in which the connector is mounted on the second surface.

According to (15), since the connector is mounted on the second surfacein the same manner as the switch, the connector and the switch can bemounted close to each other. Accordingly, a length of a portion thatelectrically connects the connector and the switch can be shortened, anda power loss between the connector and the switch can be reduced.Further, by shortening the length of the portion that electricallyconnects the connector and the switch, it is possible to prevent aninfluence of a pulsed current that flows through the portion on otherelements.

(16) The power supply unit for the aerosol generation device accordingto (14),

in which the second surface faces the power supply, and/or the secondsurface is disposed closer to the power supply than the first surface.

According to (16), it is possible to prevent the power supply from beingheated by heat generated when the boost converter functions.

(17) The power supply unit for the aerosol generation device accordingto any one of (1) to (16), further including:

a variable resistor (the variable resistor VR4) connected between theconnector and the power supply.

According to (17), since the variable resistor connected between theconnector and the power supply is provided, even when noise such asstatic electricity enters from the connector, a system of the powersupply unit such as the power supply can be protected by the variableresistor from the noise.

(18) The power supply unit for the aerosol generation device accordingto (17),

in which the variable resistor is connected to an output side of theswitch.

According to (18), since the variable resistor is connected to theoutput side of the switch, even when the noise such as the staticelectricity enters from the connector, the switch can be protected fromthe noise.

(19) An aerosol generation device including the power supply unit forthe aerosol generation device according to any one of (1) to (18), theaerosol generation device including:

the power supply unit;

the heater;

a storage portion (the reservoir 23) configured to store the liquidaerosol source; and

a transport portion (the wick 24) configured to transport the aerosolsource from the storage portion to a position where the aerosol sourcecan be heated by the heater.

According to (19), it is possible to prevent a supply of excessive powerto the heater with respect to an amount of an aerosol source that can bestored in the storage portion and an amount of an aerosol sourcetransported to the heater by the transport portion.

What is claimed is:
 1. A power supply unit for an aerosol generationdevice comprising: a connector to which a heater configured to heat anaerosol source is connected; a power supply; a boost converter connectedbetween the power supply and the connector; a switch connected betweenthe boost converter and the connector; and a controller configured toswitch the switch at a duty ratio of less than 1, wherein the duty ratiois single and fixed.
 2. A power supply unit for an aerosol generationdevice comprising: a connector to which a heater configured to heat anaerosol source is connected; a power supply; a boost converter connectedbetween the power supply and the connector; a switch connected betweenthe boost converter and the connector; and a controller configured toswitch the switch at a duty ratio of less than 1, wherein the controlleris configured to acquire information on a remaining capacity of thepower supply, and wherein the controller is configured to equalize theduty ratio when information on the remaining capacity indicates a fullycharged state of the power supply and the duty ratio when information onthe remaining capacity indicates an end-of-discharging state of thepower supply.
 3. The power supply unit for the aerosol generation deviceaccording to claim 1, further comprising: a load that is separate fromthe heater and functions by power supplied from the power supply,wherein the controller is configured to stop a function of the loadwhile causing the boost converter and the switch to operate.
 4. Thepower supply unit for the aerosol generation device according to claim1, wherein the boost converter includes a pin configured to specify anoperation mode when the boost converter operates, and wherein a fixedvalue is input to the pin.
 5. The power supply unit for the aerosolgeneration device according to claim 1, wherein the boost converter isconfigured to output 4.0 to 4.5 V.
 6. The power supply unit for theaerosol generation device according to claim 5, wherein the boostconverter is configured to output 4.0 to 4.2 V.
 7. The power supply unitfor the aerosol generation device according to claim 1, wherein theboost converter is configured to output a voltage equal to or lower thana fully charged voltage of the power supply.
 8. The power supply unitfor the aerosol generation device according to claim 1, furthercomprising: a first smoothing capacitor connected to an output side ofthe boost converter; and a second smoothing capacitor connected to anoutput side of the switch.
 9. The power supply unit for the aerosolgeneration device according to claim 8, wherein a capacitance of thefirst smoothing capacitor is different from a capacitance of the secondsmoothing capacitor.
 10. The power supply unit for the aerosolgeneration device according to claim 8, wherein a capacitance of thefirst smoothing capacitor is larger than a capacitance of the secondsmoothing capacitor.
 11. The power supply unit for the aerosolgeneration device according to claim 1, wherein an on-resistance of theswitch is smaller than an on-resistance of a switch built in the boostconverter.
 12. The power supply unit for the aerosol generation deviceaccording to claim 1, further comprising: a circuit board including afirst surface on which the boost converter is mounted, and a secondsurface that is a back surface of the first surface or that ispositioned on a back side of the first surface and on which the switchis mounted.
 13. The power supply unit for the aerosol generation deviceaccording to claim 12, wherein the connector is mounted on the secondsurface.
 14. The power supply unit for the aerosol generation deviceaccording to claim 12, wherein the second surface faces the powersupply, and/or the second surface is disposed closer to the power supplythan the first surface.
 15. The power supply unit for the aerosolgeneration device according to claim 1, further comprising: a variableresistor connected between the connector and the power supply.
 16. Thepower supply unit for the aerosol generation device according to claim15, wherein the variable resistor is connected to an output side of theswitch.
 17. An aerosol generation device including the power supply unitfor the aerosol generation device according to claim 1, the aerosolgeneration device comprising: the power supply unit; the heater; astorage portion configured to store the liquid aerosol source; and atransport portion configured to transport the aerosol source from thestorage portion to a position where the aerosol source can be heated bythe heater.